半导体词汇缩写表

半导体词汇缩写表A/Danalog to digitalAAatomic absorptionAASatomic absorption spectroscopyABCactivity-based costingABMactivity-based managementACalternating current; activated carbonACFanisotropic conductive filmACIafter-clean inspectionACPanisotropic conductive pasteACTalternative control techniques; actual cycle timeADCanalog-to-digital converterADEadvanced development environmentADIafter-develop inspectionADTapplied diagnostic techniqueADTSEMApply/Develop Track Specific Equipment ModelAEatomic emission; acousticemission; absolute ellipsometryAECadvanced equipment controllerAECSAdvanced Equipment ControlSystem; Automated Equipment Control SystemAEIafter-etch inspection; automated equipment interfaceAEManalytical electron microscopyAESAuger emission/electron spectroscopyAFMatomic force microscopyAFPabrasive-free polishAgsilverA-GEMTFAdvanced GEM Task ForceAGVautomated guided vehicleAHFanhydrous hydrogen fluorideAHUair handling unitAIRautomated image retrievalAlaluminumALDatomic layer depositionALEatomic layer epitaxy; application logic elementALSadvanced light source; advanced low-power SchottkyAMCairborne molecular contaminationAMHSautomated material handling systemAMTadvanced manufacturing technologyAMUatomic mass unitANNartificial neural networkANOVAanalysis of varianceAOVair-operated valveAPadhesion promoterAPAadvanced performance algorithmAPCadvanced process controlAPCDadd-on pollution control deviceAPCFIAdvanced Process Control Framework InitiativeAPCVDatmospheric pressure chemical vapor depositionAPECadvanced process equipment controlAPIapplication programming interface; atmospheric pressure ionizationAPMatmospheric passivation module; acoustic plate modeAPRDLAdvanced Products Research and Development LaboratoryaPSMattenuating phase-shift maskAQIACCESS query interfaceAQLacceptable quality levelArargonARaspect ratioARAMSAutomated ReliabilityARCantireflective coatingARDEaspect ratio-dependent etchingARPAAdvanced Research Projects Agency (see DARPA)ARSangle-resolved scatteringAsarsenicAS/RSautomated storage and retrieval systemASAPAdvanced Stepper Application ProgramASICapplication-specific integrated circuitASOautomatic shutoffASPadvanced strip and passivation; advanced strip processorASRautomated send receiveATDFAdvanced ToolDevelopment FacilityATEautomatic test equipmentATGautomatic test generationATLASabbreviated test language for all systemsatmatmosphereATPadvanced technology program; adenosine triphosphate; acceptance and tool performanceATRattenuated total reflectanceAttattenuatedAugoldAVPadvanced vertical processorAVSadvanced visualization systemAWEasymptotic waveform evaluationAWISPMabove wafer in situ particle monitoringAWSadvanced wet stationBbillion; boronBabariumBARCbottom antireflective coatingBASEBoston Area Semiconductor Education (Council)BAWbulk acoustic waveBCbias contrastBDEVbehavior-level deviationBDSBrownian Dynamics SimulationBeberylliumBEOLback end of lineBESOIbonded and etchback silicon on insulatorBFbrightfieldBFGSBroyden-Fletcher- Goldfarb-Shanno optimization algorithmBFLbuffered field-effect transistor logicBGAball grid arrayBHTBrinell hardness testBibismuthBiCMOSbipolar complementary metal-oxide semiconductorBIFETbipolar field-effect transistorBIMbinary intensity maskBiMOSbipolar metal-oxide semiconductorBISTbuilt-in self-testBITbulk ion temperatureBITEbuilt-in test equipmentBMCbubble memory controllerBMDbulk micro defectBOEbuffered oxide etchantBORbottom of rangeBOSSBook of SEMI Standards; binary object storage systemBOXburied oxideBPRbeam profile reflectometry; business process reengineeringBPSGboron phosphosilicate glassBPTEOSBPSG from a TEOS sourceBrbromineBSEbackscattered electron detectionBTABbumped tape automated bondingBVbreakdown voltageCcarbonCacalciumCACIM architectureCAACIM applications architectureCABCompetitive Analysis BenchmarkingCADcomputer-aided designCADTcontrol application development toolCAEcomputer-aided engineeringCAIcomputer-assisted instructionCAMcomputer-aided manufacturingCAPScomputer-assisted problem solvingCARchemically amplified resistCARRIComputerized Assessment of Relative Risk ImpactsCASEcomputer-aided softwareengineering; computer-aided systems engineeringCATcomputer-aided testingCAWConstruction Analysis WorkgroupCAWCcryogenic aerosol wafer cleaningCBGAceramic ball grid arrayCBSchemical bottle storage areaCBTcomputer-based trainingCCchip carrier; cluster controllerCCCceramic chip carrierCCDcharge-coupled deviceCCSLcompatible current-sinking logicCCWcounterclockwiseCdcadmiumCDcritical dimensionCD/OLcritical dimension overlayCDAclean dry airCDEchemical downstream etchCDEMCustomer Delivery Enterprise ModelCDIcollector-diffusion isolationCDMCommon Device Model for SABCDOcontrolled decomposition/oxidationCDRchemical distribution roomCDSchemical distribution systemCeceriumCEcapillary electrophoresisCECcell evaluation chipCEEcontrol execution environmentCEMcontinuous emissions monitoringCER-DIPceramic dual in-line packageCFAcomponent failure analysisCFCchlorofluorocarbonCFDcomputational fluid dynamicsCFMcontamination-free manufacturingCICcleanroom interface chamberCIDcharge-injection deviceCIEcomputer-integrated engineeringCIMcomputer-integrated manufacturingCIM-OSAcomputer-integrated manufacturing-open systems architecture (ESPRIT program)CIPContinuous Improvement ProgramCISCenter for Integrated SystemsCISCcomplex instruction set computerClchlorineCLCCceramic leaded chip carrierCLICclosed-loop intensity controlCMconfiguration management; cassette moduleCMCcassette module controllerCMLcurrent mode logicCMMcapability maturity modelCMOScomplementary metal-oxide semiconductorCMPchemical mechanical planarizationCMRcommon-mode rejection ratio; cancel move requestCNCcomputer numerical control; condensation nucleus counterCNTcarbon nanotubeCocobaltCOBchip-on-boardCOCcost of consumablesCODECcoder-decoderCOEDcomputer-optimized experimental designCOGScost of goods soldCoOcost of ownershipCORBAcommon object request broker architectureCOREcomposite object referenceCOSScommon object services specificationCOTcustomer-owned toolingCoVcoefficient of varianceCpprocess capabilityCPDconcurrent product developmentCPECommunicationsCPGAceramic pin grid arrayCpkprocess capability indexCQFPceramic quad flat packCQNclosed-queuing networkCrchromiumCRCcyclic redundancy checkCRMCost/Resource ModelCscesiumCSACIM systems architectureCSEcontrol systems engineeringCSFcritical success factorCSLcurrent-steering logicCSMA/CDcarrier-senseCSPchip-scale packageCSPEDconcurrent semiconductor production and equipment developmentCSTCIM systems technologyCSTRcontinuously stirred tank reactorCSVcomma-separated variableCTCcluster tool controllerCTEcoefficient of thermal expansionCTIcycle time improvementCTMCcluster tool modular communicationsCucopperCUBcentral utility buildingCUBEScapacity utilization bottleneck efficiency systemCUIcommon user interfaceCUSUMcumulative sumCVcapacitance-to-voltageCVCMcollected volatile condensable materialsCVDchemical vapor depositionCWcontinuous waveCzCzochralski processD/Adigital to analogD/Bdie bondingDACdigital-to-analog converterDASdirect absorption spectroscopyDASSLdifferential algebraic system solverDBMSdatabase management systemDCdirect currentDCAdirect chip attachmentDCATSdouble-contained acid transfer systemDCEdistributed computer environmentDCLdigital command language; display communication logDCSdichlorosilaneDDLdevice description languageDDMSdefect data management systemDEDSdiscrete-event dynamic simulationDESdata encryption standard; display equipment statusDFdarkfieldDFCdensified fluid cleanDFEdual-frequency etchDFMdesign for manufacturingDFRdesign for reliabilityDFTdesign for testDFYdesign for yieldDHFdilute hydrofluoric acidDIdeionized; dielectric isolationDIBLdrain-induced barrier leakageDICdifferential interference contrastDILdual in-lineDIPdual in-line packageDLBIdevice-level burn-inDLOCdeveloped source lines of codeDLSdisplay lot statusDLTdevice-level testDLTSdeep-level transient spectroscopyDMAdirect memory access; dynamic mechanical analysisDMHdisplay message helpsDMLdata manipulation language; display message logDMMdigital multimeterDMOSdiffused metal-oxide semiconductorDMRdisplay move requestsDOdynamic optimizationDOAdead-on alignmentDOASdifferential optical absorption spectroscopyDOEdesign of experimentsDOFdepth of focusDOPdioctylphthalateDPAdestructive physical analysisDPMdigital panel meterDPPdischarge-produced plasmaDPSRAMdual-port static random access memoryDRAMdynamic random access memoryDRAPACDesign Rule and Process Architecture CouncilDRCdesign rule checkDREdestruction removal efficiencyDRIFTSdiffuse reflectance infrared Fourier transform spectroscopyDRTdefect review toolDSAdisplay system activity; dimensionally stable anodeDSCdifferential scanning calorimetryDSMCdirect simulation Monte CarloDSQdownstream quartzDSSdisplay stocker statusDSWdirect step-on-waferDTdynamic testDTAdifferential thermal analysisDTCdirect thermocouple controlDTLdiode transistor logicDTMdefect test monitor; delay time multiplier; device test module; digital terrain mapDTMPNdefect test monitor phase numberDUTdevice under testDUVdeep ultravioletDVdesign verificationDVERdesign rule verificationDVMdigital voltmeterDVSdisplay vehicle statusDWGdomain work groupEAPSMembedded attenuated phase-shift maskEAROMelectrically alterable read-only memoryEASEequipment and software emulatore-beamelectron beamEBHTelectron-beam high-throughput lithographyEBICelectron beam-induced currentEBRedge bead removalECengineering change; equipment controllerECAengineering capability assessmentECADelectronic computer-aided design; engineering computer-aided designECAEelectronic computer-aided engineeringECLemitter coupled logicECNengineering change noticeECOengineering change orderECQBelectrochemical quartz crystal balanceECRelectron cyclotron resonanceEDAelectronic design automationEDSenergy-dispersive spectroscopyEDUequipment-dependent uptimeEDXenergy-dispersive X-rayEDXAenergy-dispersive X-ray analysisEEDFelectron energy distribution functionEELSelectron energy-loss spectroscopyEEPROMelectrically erasable programmable read-only memoryEFEMequipment front-end moduleEFOCSevanescent fiber-optic chemical sensorEFTIRemission Fourier transform infrared spectroscopyEFVexcess flow valveEGEethylene glycol ethersEHSextremely hazardous substanceEIequipment integrationEIDEquipment InterfaceDevelopmentEIPEquipment Improvement Program; Equipment Improvement ProjectEISelectrochemical impedance spectroscopyEKFextended Kalman filterELFextremely low frequencyEMenterprise model; electromagnetic; electromigrationEMAequipment maturity assessmentEMCelectromagnetic capability; electromagnetic compatabilityEMFelectromagnetic fieldEMGelectromigrationEMIelectromagnetic interferenceEMMAelectron microscopy and microanalysisEMPelectromagnetic pulseEMRenter move requestEMUelectromagnetic unitEOSelectrical overstressEOTend of transfer; equivalent oxide thicknessEPextreme pressure; electropolishEPLelectron projection lithographyEPRelectron paramagnetic resonanceEPROMelectrically programmable read-only memoryEPSSelectronic performance support systemEPTequipment performance trackingEQUIPC/I equipment control and integrationEQUIPRTC equipment real-time controlERAMequipment reliabilityERMenterprise reference modelERNexternal recurrent neural networkERPextended range pyrometerERSevent reporting standardERTemergency response timeESengineering specification; expert systemESCelectrostatic chuckESCAelectron spectroscopy for chemical analysisESDelectrostatic dischargeESHenvironmentESMelectronic service manualETABExecutive Technical Advisory BoardETQRExternal Total Quality and ReliabilityEUVextreme ultravioleteVelectron voltEWMAexponentially weighted moving averageFfluorineF/Ifinal inspectionFAfailure analysisFABfast atom bombardmentFAMOSfloating-gate avalanche-injection metal-oxide semiconductorFBGAfine-pitch ball grid arrayFCflip chipFCMfacilities cost modelFCSfactory control systemFDCfault detection and classificationFDEfrequency domain experimentsFDSOIfully depleted silicon on insulatorFeironFECfabrication evaluation chipFEMfinite element modelFEOLfront end of lineFESEMfield emission scanning electron microscopyFETfield-effect transistorFFTfast Fourier transformFFUfilter fan unitFIfilterability index; factory integrationFIBfocused ion beamFIDflame ionization detectorFIFOfirst-inFIMSfront-opening interface mechanical standardFLfuzzy logicFLOPCfloating point operations needed per cycleFLOTOXfloating gate tunnel oxideFLRTfactory layout/relayout toolFMforeign materialFMEAfailure mode and effects analysisFMMCfactory material movement componentFMVPFramework Member Validation ProjectFNNfeed-forward neural networkFOCSfiber-optic chemical sensorFOSBfront opening shipping boxFOUPfront opening unified podFOVfield of viewFOXfield oxideFPflash pointFPDfocal plane deviation; flat panel displayFPGAfield-programmable gate arrayFPLAfield-programmable logic arrayFPLFfield-programmable logic familyFPLSfield-programmable logic switchFPMSFactory Performance Modeling SoftwareFPROMfield-programmable read-only memoryFRACASFailure ReportingFRAMEFailure Rate Analysis and ModelingFRMBfast ramp mini batchFSGfused silica glassFSMfinite state machineFTfinal test; Fourier transformFTAfault tree analysisFTABFocus Technical Advisory BoardFTIRFourier transform infraredFWfull waveFWHMfull-width half-maximumFZfloat zoneGagalliumGACgranular activated carbonGCgas chromatography; gravimetric calibratorGCCgeneric cell controllerGCDgas chromatography distillationGCMSgas chromatography mass spectroscopyGDPPgas drive plasma pinchGDSgraphical design system; graphical design softwareGegermaniumGEMGeneric EquipmentModelGEMVSGEM verification systemGESgeneric equipment simulatorGFCgas filter correlationGFCIground fault circuit interrupterGIDLgate-induced drain leakageGILDgas immersion laser dopingGLCgas liquid chromatographyGOIgate oxide integrityGPIBgeneral-purpose interface busGSCEgas source control equipmentGTSGEM Test SystemHhydrogenHAPhazardous air pollutantHARIhigh aspect ratio inspectionHASThighly accelerated stress testingHAZCOMHazard Communication StandardHBhorizontal Bridgeman crystalHCIhot carrier injectionHCMhollow cathode magnetronHCMOShigh-density CMOSHCShot-carrier suppressedHDhigh densityHDLhardware description languageHDPhigh-density plasmaHDPEhigh-density polyethyleneHeheliumHEMhigh-efficiency matchingHEPAhigh-efficiency particulate airHfhafniumHFhydrofluoric acidHgmercuryHIBSheavy ion backscattering spectrometryHiPOxhigh-pressure oxygenHLFhorizontal laminar flowHMDShexamethyldisilizaneHMIShazardous materials inventory statementHMMPhazardous materials management planHMOShigh-performance MOS; high-density MOSHOMERhazardous organic mass emission rateHOPGhighly oriented pyrolitic graphiteHPhigh purityHPEMHybrid Plasma Equipment ModelHPIhigh pressure isolationHPLhigh-performance logicHPLChigh-performance liquid chromatographyHPMhazardous production materials; high-purity metalHPVhigh-pressure ventHRAhuman reliability analysisHRRhigh ramp rateHRTEMhigh-resolution transmission electron microscopyHSQhydrogen silsesquioxaneHTOhigh-temperature oxidationHTRBhigh-temperature reverse biasHUPWhot ultrapure waterHVACheatingIiodineI/Oinput/outputI2Lintegrated injector logicI300IInternational 300 mm InitiativeICintegrated circuit; Investment Council; ion chromatographyICAPinductively coupled argon-plasma spectrometryICMSintegrated circuit measurement systemICPinductively coupled plasmaICP-AESinductively coupled plasma atomic emission spectroscopyICP-MSinductively coupled plasma mass spectrometryICTideal cycle timeIDDQdirect drain quiescent currentIDEALinitiatingIDLinterface definition languageIDLHimmediately dangerous to life or healthIDSinteractive diagnostic systemIEAion energy analysisIECinfused emitter couplingIEDFion energy distribution functionIERNinternal-external recurrent neural networkIFinterfaceIGFETinsulated-gate field-effect transistorILBinner lead bondILDinterlevel dielectric; interlayer dielectricILSintracavity laser spectroscopyIMintegrated model; integrated metrologyIMDintermetal dielectricIMMAion microphobe mass analysisIMSion mobility spectroscopyInindiumINCAMSindividual cassette manufacturing systemIPAisopropyl alcoholIPLion projection lithographyIPTideal process timeIriridiumIRinfraredIRASinfrared reflection-absorption spectroscopyIRISimaging of radicals interacting with surfacesIRNinternal recurrent neural networkIRONMANImproving Reliability of New Machines at NightIRTC-1interconnect reliability test chip-1ISinformation systems; interface specifications; integrated systemsISCIndustry Steering CouncilISEMinspection/review specific equipment modelISMinductor super magnetronISMTInternational SEMATECHISPMin situ particle monitorISRin situ rinseISSion scattering spectroscopyITRIInterconnection TechnologyITRSInternational TechnologyIVHinterstitial via holeIVPintegrated vacuum processingJDPJoint Development ProgramJEDECJoint Electron Device Engineering CouncilJESSIJoint European Submicron Silicon InitiativeJICJoint Industrial CouncilJITjust-in-timeJJTJosephson junction transistorJVDjet vapor depositionKpotassium; thousandkeVkilo electron voltKPAkey process areaKrkryptonkVkilovoltLalanthanumLAMMAlaser micro-mass analysisLAMMSlaser micro-mass spectroscopyLCinductance-capacitance; liquid chromatographyLCAlifecycle analysisLCCleaded chip carrierLCLlower confidence limitLDDlightly doped drainLDLlower detection limitLDPlow-density plasmaLDPElow-density polyethyleneLECliquid encapsulated Czochralski crystalLELlower explosive limitLERline edge roughnessLFlaminar flowLFLlower flammable