液晶显示器行业内中英文对照表Word

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1、附： 缩略语中英文对照表A ACF Anisotropic Conductive Film 各向异性导电薄膜ADC Analog-Digital Converter 模数转换器AES Auger Electron Spectrometer 俄歇电子能谱仪AFFSAdvanced FFSAFLC Anti-Ferroelectric Liquid Crystal 反铁电液晶 AMLCD Active Matrix Liquid Crystal Display有源矩阵液晶显示器件AMOLEDActive Matrix Organic Light Emitting Display有源矩阵有机电致发光

2、二极管APCVD Atmospheric Pressure Chemical Vapor Deposition常压化学气相沉积AP Plasma Atmospheric Pressure Plasma 常压等离子清洗AQK Aqua Knife 水刀清洗a-Si Amorphous Silicon 非晶硅AS-IPS Advanced-Super-In-Plane Switching 超高级面内切换宽视角技术BBCE Back Channel Etched 背沟道刻蚀型BEF Brightness Enhancement Film 增亮膜BEW Blurred Edge width 边界模糊区

3、域宽度B/L Back Light 背光源BM Black Matrix 黑色矩阵或黑矩阵BS Back Channel Stop背沟道保护型BJ Bubble Jet 气泡清洗方法,又被称为CJC CCD Charge Coupled Device 电荷耦合器件CCFL Cold Cathode Fluorescent Lamp（Light）冷阴极荧光灯CD Critical Dimension 显影后或刻蚀后的图形尺寸CF Color Filter 彩色滤光片CFI Color Filter Integration 彩色滤光片集成CIE Commission Internationale

4、de l'Eclairage 国际照明委员会CJ Cabitation Jet用加了高压的去离子水与空气混合后所产生的大量气泡来去除灰尘的一种清洗方法COA Color Filter on Array 阵列上彩色滤光片COF Chip On Film 薄膜芯片集成COG Chip On Glass 玻璃芯片集成COP Cycio Olefins Polymer 环烯烃聚合物CRT Cathode Ray Tube 阴极射线管CVD Chemical Vapor Deposition 化学气相沉积CSTNColor STN彩色超扭曲向列型D DAP Depth AES

5、 Profiles俄歇深度剖面分析D.C. Direct Current 直流DICD Development Inspection CD 显影后光刻胶之间的间距DI water Deionized water 去离子水DLDS Dynamical Low Discrepancy Sequences 网点图案生成方法DLPDigital Light Processing数字光处理器DMDDigital Micromirror Device数字微镜装置DRCR Contrast Ratio in Dark Room 暗室对比度E ECR Electron Cyclotron Resonance

6、电子回旋共振刻蚀EMI Electro Magnetic Interference 电磁干扰EML Emission layer 发光层EPD End Point Detection 刻蚀结束点的测量EPD Electronic Paper Display电子纸张显示器件ESR Enhanced Specular Reflector 光学增强反射膜ETL Electron transport layer电子传输层FFED Field Emitting Display 场致发射显示器FFD Feed Forward Drive 过驱动FFL Flat Fluorescent Lamp 平面荧光灯

7、FFS Fringe Field Switching 边缘场转换宽视角技术 FICD Final Inspection CD刻蚀完成后被刻物质外观图形间距测试得到的尺寸FLC Ferroelectric Liquid Crystal 铁电液晶FPDM Flat Panel Display Measurements 平板显示测量方法FSC Field-Sequential Color 场序彩色GHHTL Hole transport layer 空穴传输层HTPS High Temperate Polycrystal Silicon高温多晶硅IIC Integrate Circuit 集成电路I

8、CM Illumination and Color Management 照明色彩管理IEC International Electrical Commission 国际电工委员会ILBInner Lead Bonding内引线焊接IPS In-Plane Switching 面内切换宽视角技术IR Infrared Ray 远红外线IS Inverted Staggered 反交叠结构ISO International Organization for Standardization 国际标准化组织ITO Indium Tin Oxide 锡掺杂氧化铟薄膜JKLLCOSLiquid Crys

9、tal On Silicon硅基液晶（液晶反射式）LCD Liquid Crystal Display 液晶显示器LDD Lightly Doped Drain 微掺杂沟道型LDS Low Discrepancy Sequences 超均匀分布列理论LED Light Emitting Diode 发光二极管LGP Light Guide Plate 导光板LMD Light Measurement Device光学测试仪器LPCVD Low Pressure Chemical Vapor Deposition低压化学气相沉积LP-MBE Low Pressure Molecular Beam

10、 Epitaxy 低压分子束外延LRCR Contrast Ratio in Lighted Room 亮室对比度LTPS Low Temperate Polycrystal Silicon低温多晶硅LVDS low Voltage Differential Signaling低压差分信号MMCU Micro Control Unit 微控制单元MOS-FET Metal Oxide SiliconField Effect Transistor 金属-氧化物-硅场效应晶体管MPRT Moving Picture Response Time 运动图象响应速度MS Mega Sonic MHz的超

11、声波清洗方法MVA Multi-domain Vertical Alignment 多畴垂直取向NNB Notebook笔记本电脑NS Normal Staggered 正交叠结构NTSC National Television System Committee 国际电视系统委员会O OCB Optical Compensated Bending光学补偿弯曲宽视角技术ODF One Drop Filling 液晶滴注OLB Outer Lead Bonding 外部引线连接OLED Organic Light Emitting Display有机电致发光二极管OSD On Screen Dis

12、play 屏幕菜单式调节P PAD 焊接衬垫PCB Print Circuit Board 印刷电路板PDA Personal Digital Assistant 个人数字处理机PDP Plasma Display Panel等离子体显示屏PE Plasma Etching 等离子体刻蚀PECVD Plasma Enhanced Chemical Vapor Deposition 等离子体增强化学气相沉积PEP Photo Engraving Process 光刻工艺PI Polyimide 聚酰亚胺取向层PLED Polymer Light Emitting Diode 高分子有机电致发光显

13、示器PMMA Polymethyl Methacrylate 聚甲基丙烯酸甲酯POL Polarizer 偏振片PR Photo Resist 光刻胶p-Si Polycrystal Silicon(Polysilicon) 多晶硅PVA Patterned Vertical Alignment 垂直取向构型PVA Polyvinyl Alcohol 聚乙烯醇PWM Pulse width modulation 脉冲宽度调制QQVGAQuarter Video Graphics Array1/4视频圆形阵列（240×320象素)RRB Roll BRUSH 辊刷RF Radio Fr

14、equency 射频RF Power Radio Frequency Power射频功率RGB Red Green Blue 红绿蓝RIE Reactive Ion Etching 反应离子刻蚀S SEM Scanning Electron Microscope扫描电子显微镜SEMI Semiconductor Equipment and Materials International 国际半导体设备与材料协会SIDSociety for Information Display信息显示协会S-IPS Super- In-Plane Switching 超级面内切换宽视角技术SMDSurface

15、 Mounted Device表面贴装器件SOC System On Chip 芯片上系统SOG System On Glass 玻璃上系统SOP System On Panel 屏上系统SPC Solid Phase Crystallization 固相晶化法SPWG Standard Panel Working Group 屏标准化工作组SSFLC Surface Stabilized Ferroelectric Liquid Crystal表面稳定化双稳态模式STN Super Twisted Nematic 超扭曲向列型SW Shower 喷淋清洗T TAB Tape Automate

16、d Bonding 带载自动连接TAC Triacetyl Cellulose 三醋酸纤维素TCON Timing Controller 时序控制器TCPTape Carrier Package 带载封装TEM Transmission Electron Microscope 透射电子显微镜TFT-LCD Thin Film Transistor Liquid Crystal Display 薄膜晶体管液晶显示器TMDS Transition Minimized Differential Signaling最小化传输差分信号TN Twisted Nematic 扭曲向列型UUS UltraSo

17、nic 超声波清洗UV UltraViolet lamp 紫外灯清洗VVA Vertical Alignment垂直取向VESA Video Electronics Standards Association 视频电子标准协会WWB Wire Bonding 线连接XXPS X-ray Photoelectron Spectrom X射线光电子能谱分析YZ工业常用的英文缩写品质人员名称类QC quality control 品质管理人员FQC final quality control 终点质量管理人员IPQC in process quality control 制程中的质量管理人员OQC

18、output quality control 最终出货质量管理人员IQC incoming quality control 进料质量管理人员TQC total quality control 全面质量管理 POC passage quality control 段检人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员QE quality engineering 品质工程人员品质保证类FAI first article inspection 新品首件检查 FAA first article assurance 首件确

19、认CP capability index 能力指数 媵CPK capability process index 模具制程能力参数SSQA standardized supplier quality audit 合格供货商品质评估FMEA failure model effectiveness analysis 失效模式分析FQC运作类AQL Acceptable Quality Level 运作类允收品质水准 S/S Sample size 抽样检验样本大小ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的MIN Minor 轻微的

20、Q/R/S Quality/Reliability/Service 品质/可靠度/服务P/N Part Number 料号 藊L/N Lot Number 批号AOD Accept On Deviation 特采UAI Use As It 特采FPIR First Piece Inspection Report 首件检查报告PPM Percent Per Million 百万分之一 制程统计品管专类SPC Statistical Process Control 统计制程管制SQC Statistical Quality Control 统计质量管理 GRR Gauge Reproductive

21、ness & Repeatability 量具之再制性及重测性判断量可靠与否DIM Dimension 尺寸DIA Diameter 直径 N Number 样品数其它品质术语类 QIT Quality Improvement Team 品质改善小组 ZD Zero Defect 零缺点QI Quality Improvement 品质改善 QP Quality Policy 目标方针TQM Total Quality Management 全面品质管理 RMA Return Material Audit 退料认可7QCTools 7 Quality Control Tools 品管七

22、大手法 通用之件类ECN Engineering Change Notice 工程变更通知(供货商)ECO Engineering Change Order 工程改动要求(客户) PCN Process Change Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Standard Inspection Procedure 制程检验标准程序 SOP Standard Operation Procedure 制造作业规范 IS Inspection Specification 成品检验规范 BOM Bill Of Material 物料清单

23、PS Package Specification 包装规范 SPEC Specification 规格 DWG Drawing 图面 系统文件类ES Engineering Standard 工程标准IWS International Workman Standard 工艺标准 ISO International Standard Organization 国际标准化组织 GS General Specification 一般规格部类 PMC Production & Material Control 生产和物料控制 PCC Product control center 生产管制中心

24、PPC Production Plan Control 生产计划控制MC Material Control 物料控制 DC Document Center 资料中心QE Quality Engineering 品质工程(部) QA Quality Assurance 品质保证(处) QC Quality Control 质量管理(课) PD Product Department 生产部 LAB Laboratory 实验室 IE Industrial Engineering 工业工程 R&D Research & Design 设计开发部 生产类 PCs Pieces 个(根,

25、块等) PRS Pairs 双(对等) CTN Carton 卡通箱 PAL Pallet/skid 栈板 PO Purchasing Order 采购订单 MO Manufacture Order 生产单 D/C Date Code 生产日期码 ID/C Identification Code (供货商)识别码SWR Special Work Request 特殊工作需求L/N Lot Number 批号 P/N Part Number 料号 OEM Original Equipment Manufacture 原设备制造 PC Personal Computer 个人计算机 CPU Cen

26、tral Processing Unit 中央处理器 A.S.A.P As Soon As Possible 尽可能快的 E-MAIL Electrical-Mail 电子邮件N/A Not Applicable 不适用 QTY Quantity 数量 I/O input/output 输入/输出 NG Not Good 不行,不合格 C=0 Critical=0 极严重不允许APP Approve 核准,认可,承认CHK Check 确认 ASS'Y Assembly 装配,组装 T/P True Position 真位度 5WIH When, Where, Who, What, W

27、hy, How to 6M Man, Machine, Material, Method, Measurement, Message 4MTH Man, Material, Money, Method, Time, How 人力,物力,财务,技术,时间(资源) SQA Strategy Quality Assurance 策略品质保证DQA Design Quality Assurance 设计品质保证 MQA Manufacture Quality Assurance 制造品质保证SSQA Sales and service Quality Assurance 销售及服务品质保证 LRR L

28、ot Reject Rate 批退率DVD Digital Video DiskVCD Video Compact Disk LCD Liquid Crystal Display CAD Computer Aided Design CAM Computer Aided Manufacturing CAE Computer Aided Engineering PCB Printed Circuit Board 印刷电路板 CAR Correction Action Report 改善报告NG Not Good 不良 WDR Weekly Delivery Requirement 周出货要求 PP

29、M Percent Per Million 百万分之一 TPM Total Production Maintenance 全面生产保养 MRP Material Requirement Planning 物料需计划OS Operation System 操作系统 TBA To Be Assured 待定,定缺 D/C Drawing Change P/P Plans & Procedure EMI Electrical-Music Industry 电子音乐工业 Electrical Magnetic Interference 电子干扰RFI Read Frequency Input

30、读频输入MMC Maximum Material Condition MMS Maximum Material Size XsLMC Least Material ConditionLMS Least Material Size Um LED lighting-emitting diode 发光二极管QBR Quarter Business Record CIP Continuous improvement process FGI Forecasted Goal Inventory CNC Computerized numeral controller B2C Business to customer B2B Business to business AVL Approved vendor list POP Procedure of packaging EOL End of life VDCS Vender defect correcting sheet PDCS Process defect correcting sheet GRN Goods receiving note A/R Accounting receivable A/P Accounting payable （注：文件素材和资料部分来自网络，供参考。请预览后才下载，期待你的好评与关注。）