PCBFlowTraining

《PCBFlowTraining》由会员分享，可在线阅读，更多相关《PCBFlowTraining（35页珍藏版）》请在装配图网上搜索。

1、PCB Manufacturing&Inspection IntroductionSupervisor QA DepartmentStephen Cheng PCB Industry Story Classification of PCBs Application of PCBs PCB Manufacturing Flows -Rigid BoardAGENDA3PCB Industry StoryWhat is“PCB”?v Printed Circuit Boardv Products made by“Pattern Printing Technology”v Fast,Mobile,a

2、nd Massive duplication of products in Small Sizes and Low Costs.4PCB Industry StoryEvolution of PCBv 1903:Copper Wiring Methodologyv 1904 1935:Casting Technologyv 1936 1959:Print-and-Etch Technologyv 1960 Present:Double-side PCB with PTH5PCB Industry StoryCasting Technology(1904 1935)-by Mr.Albert H

3、anson6PCB Industry StoryPrint-n-Etch Technology(1936 1959)-by Dr.Paul Eisner7PCB Industry StoryDouble-side PCB+PTH(1960)-Epoxy laminate introducedPTHsBottom Side PatternTop Side Pattern8Classification of PCBsMaterial-wise:v Organic Materials -Bakelite/Fiberglass/Epoxy Resin/Polyimide/BTv Inorganic M

4、aterials -Aluminum/Copper-invar-Copper/Ceramic 9Classification of PCBsRigidness-wise:v Rigid PCBv Flexible PCBv Rigid-Flex PCB10Classification of PCBsConstruction-wise:v Single side PCBv Double side PCBv Multi-layer PCB11Application of PCBsPopular Applications of PCBs:v Information Technology Indust

5、ry (Super Computer,CAD/CAM System,Notebook PC,Automobile Control System,Electronic Device&Package)v Telecommunication (Cell Phone,Internet System,Network,Modem)v Consumer Products (Electronic Games,TVs,Recorders,VCRs,Digit Camera)12Application of PCBsTypical PCB Application in Desktop PCIC Package/T

6、estingWaferIC ChipAssembling(Card)Computer SystemAssembling(Mainboard)13Rigid PCB Manufacturing FlowsNormal Rigid PCB MFG Process FlowMaterial IssueInner LayerBlack OxideMLB Lam.DrillingPTHPNL PlatingO/L Dry FilmPattern PlatingSolder ResistSurface TreatRoutingCleaningET/INSPPack/Ship14Rigid PCB Manu

7、facturing FlowsMaterial IssueTo cut the sheet size of copper clad laminate(CCL)to working size for production.15Rigid PCB Manufacturing FlowsInner Layer-PretreatmentTo treat laminate surface by using chemical or mechanical process to rough copper surface and make it read for resist coating.This pret

8、reatment concept also applies to manufacturing stages such as“outer layer dry film”and“solder mask coating”processes.Popular pretreatment method:-Scrubbing-Micro-etch-Pumice16Rigid PCB Manufacturing FlowsInner Layer Dry Film LaminationTo create a photo-sensitive resist layer on boards.17Rigid PCB Ma

9、nufacturing FlowsInner Layer Image TransferTo transfer the image from artwork to boards through exposure process.18Rigid PCB Manufacturing FlowsInner Layer Etching&StrippingTo remove copper on exposed area defined at image transfer stage and then strip etching resist to reveal copper pattern.So call

10、ed“DES”line.19Rigid PCB Manufacturing FlowsBlack OxideTo rough pattern surface to increase the bonding strength between copper and resin.20Rigid PCB Manufacturing FlowsMLB Lamination Lay upTo organize the board sequence and stacking.21Rigid PCB Manufacturing FlowsMLB Lamination Riveting&Booking To r

11、iveting boards after lay-up to align the inner layer patterns and stabilize to related positions during hot pressing.22Rigid PCB Manufacturing FlowsMLB Lamination Hot PressTo use heating system to melt the resin then followed by vacuum chamber and pressure to fill up the empty space and cure the res

12、in at the same time.23Rigid PCB Manufacturing FlowsMLB Lamination Post TreatmentTo use Target Drill to transfer the reference target up to outer layer surface.24Rigid PCB Manufacturing FlowsDrillingTo create connecting channels between outer and inner metal layers.25Rigid PCB Manufacturing FlowsDril

13、ling Registration CheckTo use X-ray as a inspection tool to see if the drilling hole and copper land have mis-alignment problem;co-circle designed target is in popular use.26Rigid PCB Manufacturing FlowsPTH&Panel PlatingTo use Electro-less Copper Disposition(chemical way)and Copper Electro Panel Pla

14、ting(electrical)to enable hole wall to connect patterns of different layers.27Rigid PCB Manufacturing FlowsOuter Layer Dry Film-LaminationTo create photo resist layer on outer layer for pattern creation.28Rigid PCB Manufacturing FlowsOuter Layer Dry Film Image TransferTo transfer image from artwork

15、to boards through exposure.Pattern defined after developing is so called“Plating Resist”for post plating process.29Rigid PCB Manufacturing FlowsPattern PlatingTo increase copper thickness in PTHs and on outer layer patterns and also to build a tin coating layer as etching resist.Etching resist30Rigi

16、d PCB Manufacturing FlowsPatter Plating Patter CreationTo remove plating resist(dry film)and expose copper underneath for etching;tin coating is served as etching resist for protecting pattern required.This typical film stripping/pattern etching/tin stripping line is so called“SES”line.31Rigid PCB M

17、anufacturing FlowsSolder ResistTo define assembly/selective areas for assemblers soldering process and prevent pattern damage or oxidation.32Rigid PCB Manufacturing FlowsSurface TreatmentTo apply metal or organic finish on solder mask defined lands;kinds of assembly inquiries are to be considered fo

18、r surface finish selection.Popular Surface Treatment:-HASL-Immersion Nickel/Gold-OSP(Organic)-Nickel/Gold Plating-Immersion Silver33Rigid PCB Manufacturing FlowsRoutingTo use routing or punching method to make the required outline of boards;additional post processes such as V-cutting or Beveling is

19、considered for different purpose.34Rigid PCB Manufacturing FlowsElectric Testing&Visual InspectionTo perform continuity and isolation tests on boards to ensure its functionality is working properly.After E-testing,so called OPEN/SHORT test,boards are passed to inspection area for 100%visual inspecti

20、on and the acceptance criteria are based on IPC-A-600 class 2,or per customer defined.35Rigid PCB Manufacturing FlowsPacking&ShippingTo vacuum or heat seal finished boards with desiccant inside for storage conditions controland to prevent water absorption which maycause surface finish degradation or oxidation.Finally,packaged boards are to be put into cartons,bundled,labeled,and shipped to customers.