Camera Module封装方式
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1、Single Chip Solution (ISP embedded type) 1) Module assembly using with prepackaged plastic or ceramic unit CONNECTORLENS HOLDERFPC(CIS + ISP) CHIPPCBPrepackaged Ceramic unitLENS ASSYIR CUT FILTERPASSIVE STIFFENERSingle Chip Solution (ISP embedded type)2) Module assembly using with prepackaged Glass
2、CSP unit CONNECTORLENS HOLDERFPCPrepackaged GlassCSP unitPASSIVE STIFFENERLENS ASSYIR CUT FILTERSTIFFENERSingle Chip Solution (ISP embedded type)3) Module assembly using with Chip On Board (COB)CONNECTORLENS HOLDERFPCWIREPASSIVE DVC(CIS + ISP) CHIPLENS ASSYPCBIR CUT FILTERACFPassiveIR FilterCMOSCONN
3、ECTORSingle Chip Solution (ISP embedded type) 4) Module assembly using with Chip On FPC(COF)Single Chip Solution (ISP embedded type)5) Module assembly using with flip-chip bonding technologyCONNECTORLENS HOLDERFPCPASSIVE DVCLENS ASSYSUBSTRATEIR CUT FILTER OR GLASSCIS CHIPACFSingle Chip Solution (ISP
4、 embedded type) 4) Module assembly using with chip stacking methodCONNECTORLENS HOLDERFPCWIREPASSIVE DVCDSP CHIPLENS ASSYPCBIR CUT FILTERCIS CHIPTwo Chip Solution (Image sensor & DSP)2) Module assembly using with DSP embedded PCBCONNECTORLENS HOLDERFPCWIREPASSIVE DVCDSP CHIPLENS ASSYPCBIR CUT FILTER
5、CIS CHIPTwo Chip Solution (Image sensor & DSP)3) Module assembly using with DSP on the back sideCONNECTORLENS HOLDERFPCWIREPASSIVE DVCDSP CHIPLENS ASSYPCBIR CUT FILTERCIS CHIPCamera Module Design ProcessStructure for sample buildModule DimensionChip InformationA. Video FormatB. Pixel Size C. Image A
6、rea SizeD. Image Area Position(X, Y)E. Chip SizeF. Wafer ThicknessG. Chip shiftLens designLens SpecA. Lens constructionB. Angle of viewC. Focal lengthD. Relative apertureE. Relative illuminationF. Back focal lengthG. EtcLens assy designSubstrate DimensionA. PCB size & thicknessB. Bottom mold size &thicknessC. PCB pin hole size & positionHolder design IR filter sizeFPC informationA. Module mounting method (Direct main board insert or FPC)B. FPC bonding land layoutC. ZIF connector modelD. FPC lengthFPC designPacking informationA. Tray dimensionB. Tray arrayTray designBoard design
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