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1、塑胶电镀介绍塑胶电镀介绍pptppt课件课件 塑膠電鍍介紹 Plating on Plastics塑膠電鍍原理及注意事項塑膠電鍍原理及注意事項Principles of Plating on Plastic 第一站第一站 素材選擇素材選擇 ABS塑料案例塑料案例(Step 1:Selecting Material ABS Plastic Case)1.最好採用電鍍級最好採用電鍍級ABSABS塑膠如圖所示其丁二烯含量塑膠如圖所示其丁二烯含量15%16%15%16%密著密著強度最好強度最好 Selects the ABS plastics showing on the right which th

2、e butadiene is 15%-16%.Its adhesion is best.2.采用采用70%95%PC+ABS70%95%PC+ABS材料要請供應商提供防火材料材料要請供應商提供防火材料%、PC%PC%、等相關資料等相關資料 Applier should offer fireproof material,PC%,etc,and references before selecting 70%-95%PC+ABS.3.塑膠電鍍原料應完全乾燥塑膠電鍍原料應完全乾燥(含水率含水率0.1%0.1%以下以下)Materials of plating on plastic should be

3、dried totally.4.塑膠電鍍原料盡量避免染色塑膠電鍍原料盡量避免染色Materials of plating on plastic must prevent dyeing.5.塑膠電鍍原料塑膠電鍍原料ULUL認證認證 Materials Materials of plating on plastic should of plating on plastic should be attested by UL.be attested by UL.0.51.52.02.53.03.54.04.51.0141915161718密著強度Kgf/cm丁二烯t%各材質丁二烯之含量塑膠電鍍介紹Pl

4、ating on Plastics HardnessResistance to solventANTI-UV Fineness of surface Verge coverage operationEvenness of membrane R.C.A price Technique norm Adhesion of dust Dropping of liquidElectric power function EMI ESD quality of batchproduction Sense about mentalElectrical Applianceplating 9Hgood good g

5、ood good complex goodPass successfullyaverage HIGH NO YESgood averagegood Spraying paint in vacuum+UV paint 3H good good averagegood averageaverage paverageaverage Y YSecondary process is necessarygood average Color plating5H good good good good complex good Pass successfullyexpensive HIGH N NO good

6、 good goodI.M.D 4H good pass goodgood average average passaverageaverage Y YSecondary processis necessarygood average PU paint 2H NG pass average good average average NG averageaverage Y Y Secondary processis necessarygood average UV paint3H goodpassaverageaverage averageaveragepassaverageaverage Y

7、Y Secondary processis necessary good average PVD TiN ZrN 9H goodpass goodgoodcomplex優良Pass successfully extremely expensivehighNO N good 優良Print in water 2H NG NGaverage average average average NG averagehigh Y N secondary processis necessary good average Item Chart of Treatments on Plastic Surfaceg

8、oodgood averageMethod塑膠電鍍介紹 Plating on PlasticsPrinciple Possibilities 原理原理Pop_met0Comparison of Foxconns Processes 制程對比制程對比Compa201.pptCleaner(Option)清潔劑（任選）清潔劑（任選）CrO3-Etch粗化粗化Reducer還原劑還原劑PrePlate Nicke預鍍鎳預鍍鎳Electroplating電鍍電鍍Accelerator加速劑加速劑Coll.Pd Catalyst離子催化劑離子催化劑PreDip預浸預浸Eless Nickel化學鎳化學鎳

9、Cleaner(Option)清潔劑（任選）清潔劑（任選）CrO3-Etch粗化粗化Reducer還原劑還原劑Electroplating電鍍電鍍CuLink銅槽銅槽Coll.Pd Catalyst離子催化劑離子催化劑PreDip預浸預浸Cleaner(Option)清潔劑（任選）清潔劑（任選）Swell+Etch粗化粗化Conditioner調解劑調解劑PrePlate Nickel預鍍鎳預鍍鎳Electroplating電鍍電鍍Reducer還原劑還原劑Ion.Pd Catalyst離子催化劑離子催化劑Eless Nickel化學鎳化學鎳Cleaner(Option)清潔劑（任選）清潔劑（

10、任選）CrO3-Etch粗化粗化Reducer還原劑還原劑PrePlate Nickel預鍍鎳預鍍鎳Electroplating電鍍電鍍Accelerator加速劑加速劑Coll.Ag Catalyst離子催化劑離子催化劑Eless nickel化學鎳化學鎳Cleaner(Option)清潔劑（任選）清潔劑（任選）CrO3-Etch粗化粗化PrePlate Nicke預鍍鎳預鍍鎳lElectroplating電鍍電鍍Reducer還原劑還原劑Ion.Pd Catalyst離子催化劑離子催化劑Eless Nickel化學鎳化學鎳Noviganth 341Noviganth AKFuturonNo

11、viganth PAMellon塑膠電鍍介紹Plating on PlasticsStructure of Polymers on ABS Basis ABS表面聚合物結構基表面聚合物結構基Abs_stru0塑膠電鍍介紹 Plating on PlasticsTheory of Adhesion:Mechanical Interconnection黏合原理黏合原理 自動連接自動連接Abs_aet30To separate the metal from theplastic,energy must be appliedto compensate the cohesiveforces in the

12、 plastic matrix(green)or in the metal(red).為將金屬從塑膠中分離出來為將金屬從塑膠中分離出來必須必須要求有能夠同塑膠母体（綠色）要求有能夠同塑膠母体（綠色）和金屬（紅色）的能量相抵之能量和金屬（紅色）的能量相抵之能量塑膠電鍍介紹 Plating on PlasticsTypical Polycarbonate“Blends 典型典型“多碳酸鹽多碳酸鹽”混合混合blends10Bayblend T45Bayblend FR1441Polycarbonate 聚碳酸鹽聚碳酸鹽Polyacrylonitrile 聚聚丙烯腈丙烯腈 Polystyrene 聚苯

13、乙烯聚苯乙烯Polybutadiene 聚丁二烯聚丁二烯Filler,Pigments,.填充料填充料 顏料顏料nArCNSANPB塑膠電鍍介紹 Plating on PlasticsSome Plateable Grade Plastics 可電鍍塑膠可電鍍塑膠galvsub0Typ 類型類型Name 名稱名稱Supplier 供應商供應商ABSABS+PCPPOPPPALCPTPONovodur P2MC,PM3CCycolacLustran PG299Ronfalin CP55Bayblend T45CycoloyNoryl PN235Codyx 4019GDurethan BM240M

14、inlon 73M40Ultramid B3M6IXEFBayer AGGeneral ElectricsMonsantoDSMBayer AGGeneral ElectricsGeneral ElectricsRTPBayer AGDuPontBASFSolvayVectraHoechst AGRD P98119Solvay塑膠電鍍介紹 Plating on PlasticsPerfectly Pretreated ABS Surface(SEM,5000 x)完全粗化處理之完全粗化處理之ABS表面表面（SEM5000 x）absaet10塑膠電鍍介紹 Plating on Plastics

15、Rinsing:Concept水水 洗洗 步驟步驟Dragout v=0,2l/m2Dragoutv=0,4l/m2Evaporationapprx 80l/hReducer還原劑還原劑Rinsing Cascade水洗過程水洗過程Etch粗化粗化(Spray Rinses have twice dilution factor)2 kg CrO3=100m2 etched ABS=5500Ah=230A in 24hR=C0/Cn=Q/VnCn=C0*V/Qn塑膠電鍍介紹 Plating on PlasticsEtching Rates of Bayblend(25cm)and Resulti

16、ng Adhesion of Plated Metal Layer.Bayblend(25cm)粗化率及電鍍后之金屬面所產生的黏附力粗化率及電鍍后之金屬面所產生的黏附力etchrough000,20,40,60,811,21,41,60100200300400Etching Rate mg粗化率粗化率Adhesion N/mm黏附力黏附力塑膠電鍍介紹 Plating on PlasticsPalladium/Tin Cluster 鈀鈀 /錫簇錫簇 cluste10Cl-Pd Sn2+0,181nm0,128nm0,093nmR.L.Cohen K.W.WestJ.Electrochem.So

17、c.120,502(1973)Core Diameter:核心直徑核心直徑3 4nmSn塑膠電鍍介紹 Plating on PlasticsElectroless Metal Deposition(Model)化學金屬沉澱物化學金屬沉澱物eless00Active plastics surface活性塑膠表面活性塑膠表面Start of metal-deposition.開始出現金屬沉澱物開始出現金屬沉澱物Complete metalization:all activator particles areconnected electricallyconductive.金屬化完成金屬化完成 所有

18、活性劑顆粒均結合在一起具導電性所有活性劑顆粒均結合在一起具導電性塑膠電鍍介紹 Plating on PlasticsElectroless Nickel Deposition I 化學鎳沉澱物化學鎳沉澱物 IStarting Reaction 初期反應初期反應Adsorptionof Reducer還原劑吸附作用還原劑吸附作用Protolysis質子遷移質子遷移Additionof Water附加水附加水Desorption 解吸附作用解吸附作用塑膠電鍍介紹 Plating on PlasticsElectroless Nickel Deposition II 化學鎳成份化學鎳成份 IISid

19、e Reactions側邊反應側邊反應Recombinationof Hydrogen Atoms:Hydrogen Gas Evolution氫原子再結合氫原子再結合成為氫气成為氫气Reduction ofHydroxide氫氧化物還原氫氧化物還原Phosphorous-Co Deposition磷酸根磷酸根 沉澱物沉澱物塑膠電鍍介紹 Plating on PlasticsElectroless Nickel Deposition III化學鎳成份化學鎳成份 IIIMetal Deposition 金屬沉澱物金屬沉澱物Main Reaction 主要反應主要反應Direct Reductio

20、nby Elektrons(only 1%)由由Elektrons直接還原直接還原（僅有（僅有1）塑膠電鍍介紹 Plating on PlasticsMechanism of the CuLink Operation(Model)銅槽機能操作（模型）銅槽機能操作（模型）culime01Activator particles are bound to a plasticssurface.活化劑顆粒同塑膠件表面結合活化劑顆粒同塑膠件表面結合Chelated copper ions are reduced to eithercopper(0)or copper(I)by tin.螯合銅離子被錫還原成

21、為銅（螯合銅離子被錫還原成為銅（0）或銅（）或銅（1）The copper crosslinks the palladiumparticles resulting in a electroconductivesurface layer.銅与鈀顆粒交叉結合形成一個導電表層銅与鈀顆粒交叉結合形成一個導電表層塑膠電鍍介紹 Plating on PlasticsCuLink-Step:Dependence of the Electrical Conductivity of a Plastics Surface from Surface Bound Amount of Copper.銅槽步驟銅槽步驟銅表

22、面范圍同塑膠表面的電導率之依從關系銅表面范圍同塑膠表面的電導率之依從關系culres00020406080100050100150200Copper 銅銅 g/dmConductivity S導電性導電性塑膠電鍍介紹 Plating on PlasticsSimplified Model of the Spreading of Metal during Plating after the CuLink Step 在完成銅槽步驟后在完成銅槽步驟后電鍍中金屬擴散的簡單模擬圖電鍍中金屬擴散的簡單模擬圖culime20Palladium cluster are crosslinked by copper or by copper ions.鈀簇由銅或銅離子相交聯構成鈀簇由銅或銅離子相交聯構成During electroplating,copper ions are reduced tocopper 在電鍍的過程中在電鍍的過程中銅離子將被還原成銅銅離子將被還原成銅 .塑膠電鍍介紹 Plating on Plastics