5DX程序开发流程

《5DX程序开发流程》由会员分享，可在线阅读，更多相关《5DX程序开发流程（82页珍藏版）》请在装配图网上搜索。

1、5DX 1.3 1.1.CAD to NDF.3 1.2.BOM.5 1.3.Test Link().9 1.4.32 2.34 1.5.Restore Program.34 1.6.34 1.7.35 1.8.SurfaceMap Points.36 1.9.Delta-Z set.39 1.10.View Verifier .40 1.11.Algorithm Tuner.42 1.12.Pins Defective.46 1.13.Short.47 1.14.Backup Program.51 3.Assign Packages.53 1.15.Family.53 1.16.Land P

2、attern.54 1.17.Land Pattern .56 4.57 1.18.Chip.57 1.19.Connector.57 1.20.FPGullwing.59 1.21.Gullwing.59 1.22.Pcap.60 1.23.Res.60 1.24.QFN.61 1.25.Paste.64 5.BGA,PTH2,PressFitConnector .65 1.26.BGA .65 1.27.PTH2 .66 1.28.PressFitConnector.67 6.68 1.29.BGA2.68 1.30.Chip.69 1.31.CONNECTOR.70 1.32.FPGUL

3、LWING.71 1.33.GULLWING.72 1.34.PASTE.73 1.35.PCAP.74 1.36.PRESSFITCONNECTOR.75 1.37.PTH2.76 1.38.QFN.77 1.39.RES.78 7.PastePackage.79 1.1.1.CAD to NDF CADWordPad!A“”CAMCAD for Windows CAMCADCAD2NDF 1.2.BOM BOM txt bom compareBOM Comform,DOS,OKNoload,Add,No Consult Noload PCB,BOM Add BOM PCBLable,Pcb

4、fab No Consult AddNo Consult 1.3.Test Link()1.3.1 Start New Project OK 1.3.2 Set Project Option 1.3.3 Define Panel Panel BoardPanel,Board Name,FlipRotation,OK Board Processes:.1.3.4.Assign Packages subtype,Package,Chkd,subtype.1.3.5 Subtype Components No Yes No No Test bom compare Noload 1.3.6 Selec

5、t Alignment Points 1.2.,0402 3.4.5.FOV 1.3.7 Setup Surface Map Points a.Map Points b.Map PointsMap Points c.BGAMap Points BGA :Map Points,1.3.8 Board Level Optional Processes 1.3.9 Panel Level Optional Processes Subtype FOV Famliy Subtype 1.3.10 Export&Compile Data Compiler ResultsPASSED 1.4.“Board

6、Level Optional Processes”Brightness 1-4 Integration 1-7 2.,Test Link,;,X,Y 1.5.Restore Program”Program Restore Tool”Restore 1.6.1.7.1.8.SurfaceMap Points :”Setup Map Points”Point.:Pad,.PCB,PCB 1.9.Delta-Z set :Laser.3-7.5 1.10.View Verifier View Verifier :Top Bottom OK.,1.11.Algorithm Tuner 1.12.Pin

7、s Defective Pins Defective Pin,1.13.Short,Short,.Short,Joint Learning,.1.14.Backup Program .3.Assign Packages Prefix,Land Pattern,Family,PackageChkd(Chkd)1.15.Family .BGA2,Chip,Connector,FPGullwing,Gullwing,Pcap,PressFitConnector,PTH2,Res,QFN,Paste.,ViaNO PACKAGE.:1.16.Land Pattern Family,.,Pin,.:C0

8、402_S0_R,C0603_S0_R 1.17.Land Pattern Package Land Pattern 4.Family,.,1.18.Chip PadThickness,Length 1.19.Connector Thickness,Length,Slope,Open signal,Open signal Across.heel location:fillet edge locations:center location:across profile location and width:side fillet search distance:across profile ce

9、nter location:1.20.FPGullwing Heel Thickness,Center Thickness,Toe Thickness,Open signal,Length.heel search distance toe location Red fillet length box 1.21.Gullwing FPGullwing,GullwingHeelToe,Open signal.1.22.Pcap Pad Thickness,Open signal,Slug slug location 1.23.Res Pad Thickness,Open signal.CAD bo

10、dy length and width fillet search region 1.24.QFN Fillet Thickness,Heel Thickness,Toe Thickness,Center Thickness,Length,Open signal.fillet edge locations heel location center location toe location 1.25.Paste Pad Thickness,Voiding,Insufficient SPC REF_BASE 1 MIN_THICK_THRESH 1.5 2.0 5.BGA,PTH2,PressF

11、itConnector ,Panel Thickness,.Panel Thickness:PinPin.1.26.BGA Upper Slice(Slice 2):,X Height22X,Height22X Mid-Ball Slice(Slice 1):PCB,Height1=X,Height1X Slice(Slice 3):PCB,Height3X,Height30:Height2-Height1=Height1-Height3 Short Shape,Open PCB 1.27.PTH2 1.Barrel.,(Bottom),75%,Barrel 25 BTM.ShortBotto

12、m,Top.,(Top),75%,Barrel 75 BTM.ShortTop,Bottom.2.(Slice 1)Barrel 50 BTM.:PinBarrel Short(Slice 2)Bottom 0 BTM:Pin 1.28.PressFitConnector PressFitConnectorPinHole,.First Slice(Slice 2):,First SlicePCB.Second Slice(Slice 1):,Second SlicePin.Barrel.Second Slice(Slice 1)Barrel 0 BTM.:PinPCBBottom First Slice(Slice 2)Top 0 BTM:PinTop 6.,.1.29.BGA2 1.30.Chip 1.31.CONNECTOR 1.32.FPGULLWING 1.33.GULLWING 1.34.PASTE 1.35.PCAP 1.36.PRESSFITCONNECTOR 1.37.PTH2 1.38.QFN 1.39.RES 7.PastePackage Paste