电解铜箔论文：添加剂对电解铜箔组织性能的影响及优化

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1、精品范文模板 可修改删除撰写人：_日 期：_电解铜箔论文：添加剂对电解铜箔组织性能的影响及优化【中文摘要】近年来铜的电沉积已经受到了广泛研究,因为铜箔在印刷电路板和覆铜板行业中得到很好的应用。而添加剂在铜电沉积过程对铜箔性能的影响中起着很重要的作用,即使是很微量的添加剂也能显著改变沉积层的性能。本文利用SEM、微机控制万能试验机、高温拉伸机、电子背散射衍射分析技术、应力仪研究了聚二硫二丙烷磺酸钠(SP)、羟乙基纤维素(HEC)、聚乙二醇(PEG)、明胶、稀土铈盐等添加剂单独及共同作用时对铜电沉积的影响。实验表明：SP整平效果较好,能提高铜箔抗拉强度和延伸率,尤其是高温延伸率。加入0.2 mgL

2、左右的SP,铜箔综合性能最好。HEC能促使晶粒面向生长,抑制针孔,但会引起铜箔翘曲。PEG能加大阴极极化,细化晶粒,使晶粒面向生长。能抑制杂质金属的电沉积,防止异常晶粒长大。同时能光滑尖锥状晶粒的峰尖,避免粗糙过度,但PEG过量会降低铜箔高温抗拉强度和延伸率。P-6000效果要好于P-8000。明胶具有细化晶粒和整平的效果,能够保证铜箔具有一定的粗糙度和提高铜箔常温抗拉强度和延伸率,但会降低铜箔高温抗拉强度和延伸率。骨胶的效果要好于胶原蛋白。适量的硫酸铈盐可以细化晶粒,使晶粒均匀致密,并能改善铜箔的力学性能,当铈离子浓度为6 mg/L,晶粒细化效果最好,力学性能最高。通过正交试验,研究了不同添

3、加剂配方对铜箔亮面晶粒微观结构、力学性能,以及内应力的影响,利用直观图示和数据分析得出了最优的3种添加剂配方,经过试验验证确定了添加剂最佳配比为：明胶、PEG、SP、HEC浓度分别为1.4mg/L、1.5 mg/L、0.35 mg/L、0.6mg/L。制备出的铜箔内应力减少,铜箔缺陷也有所减少,亮面晶粒微观结构：孪晶(界)24.3%,(111)织构22.8%,晶粒平均尺寸250.4nm,毛面晶粒分布较均匀,铜箔力学性能也能提高,其中常温和高温抗拉强度分别是：376.5 MPa、197.1MPa,常温和高温延伸率分别是：5.6%、2.8%。将此配方应用到中试线上,生产出的生箔性能优异,产品质量得

4、到明显改善。【英文摘要】The electrodeposition of Cu has been a subject of recent extensive investigations because of electrodeposition copper foils have been widely used the conductors for printed circuit boards (PCBs). Additives play a major role in controlling the properties of copper foils, even small amount

5、s of certain additives can affect the properties and aspect of the deposit.The effect of bis-(3-sulfopropyl) disulfide (SP), hydroxyethylcellulose (HEC), polyethylene glycol (PEG), gelatin and cerous sulfate on the copper electrodeposits are investigated by SEM (scanning electron microscope), microc

6、omputer control electronic universal testing machine, high temperature drawing machine, EBSD(electron backscattered diffraction) and stress gauge. The results reveal that SP can decrease the surface roughness and improve the mechanical properties, especially for elongation at room temperature. Coppe

7、r foil with maximum value comprehensive properties can be obtained with approximately 0.2 mg/L SP content. HEC can promote the growth of grain-oriented and ensure copper foil has certain roughness and improve the mechanical properties at room temperature, but reduce the tensile strength of foil at h

8、igh temperature. HEC also can inhibit the pinhole, but cause copper foil warp. PEG can increase the depositon over-potential and promote the growth of grain-oriented, resulting in grain refinement and allowing the microscopic roughness of the copper foil to be lower. PEG also has the ability to inhi

9、bit the deposition of metal impurities and prevent the growth of abnormal grain. But excess PEG will reduce the tensile strength and elongation of copper foil at high temperature. The leveling and refinement effect of gelatin are well. It can improve the tensile strength and elongation of copper foi

10、l at room temperature, but reduce the tensile strength and elongation of copper foil at high temperature. And the effect of bone glue is better than collagen. RE element can obviously improve mechanical properties of the copper foil by refining and uniformly distributing grain size in the foil, wher

11、e ideal grain size in the copper foil with maximum value mechanical properties can be obtained with approximately 6 mg/L RE content. The effects of different additive formula on the microstructure of bright side, mechanical properties and internal stress of electrodeposited copper foil are investiga

12、ted by the orthogonal test and the best 3 additive formulas were gotten by visual diagram and data analysis. The best ratio of formula was proved by experiments:Gelatin、PEG、SP、HEC was 1.4 mg/L、1.5mg/L、0.35mg/L、0.6 mg/L, respectively. The internal stress and defects of copper foil was reduced, micros

13、tructure of bright side was:twin of 24.3%, (111) texture of 24.3% and the average grain size of 250.4nm. The grains on rough surface were distributed more uniformly and mechanical properties of copper were improved as well。The tensile strength at room temperature and high temperature were 376.5 MPa

14、and 197.1MPa respectively, elongation at room temperature and high temperature were:5.6% and 2.8%respectively. The best formula is applyed to the pilot line, the performance of the crude foils gets better, and the quality of the products improves obviously.【关键词】电解铜箔 添加剂 正交试验 力学性能 内应力【英文关键词】electrode

15、position copper foi additive orthogonal test mechanical properties internal stress【目录】添加剂对电解铜箔组织性能的影响及优化摘要3-4ABSTRACT4-5第1章 绪论8-241.1 课题的背景及意义8-101.2 电解铜箔的发展历程及趋势10-121.2.1 电解铜箔的发展历程10-111.2.2 电解铜箔的发展趋势11-121.3 无机添加剂对铜电沉积的影响12-171.3.1 氯离子对铜电沉积的影响13-151.3.2 稀土离子对铜电沉积的影响15-161.3.3 其它无机离子对铜电沉积的影响16-171

16、.4 有机添加剂对铜电沉积的影响17-221.4.1 明胶对铜电沉积的影响17-191.4.2 聚乙二醇对铜电沉积的影响19-201.4.3 硫脲对铜电沉积的影响20-211.4.4 其它有机添加剂对铜电沉积的影响21-221.5 本论文研究的主要内容及创新点22-24第2章 实验方案24-322.1 实验原料与仪器24-252.1.1 实验主要原料242.1.2 实验主要设备24-252.2 实验内容与步骤25-282.2.1 添加剂单因素实验设计25-262.2.2 添加剂正交试验设计26-272.2.3 添加剂验证试验设计272.2.4 实验步骤27-282.3 实验测试方法28-32第

17、3章 单因素试验结果与讨论32-453.1 SP对铜箔组织性能的影响32-343.1.1 SP对铜箔毛面组织形貌的影响32-333.1.2 SP对铜箔物性的影响33-343.2 HEC对铜箔组织性能的影响34-363.2.1 HEC对铜箔毛面组织形貌的影响34-353.2.2 HEC对铜箔力学性能的影响35-363.3 PEG对铜箔组织性能的影响36-393.3.1 P-8000和P-6000对铜箔毛面组织形貌的影响36-373.3.2 P-8000和P-6000对铜箔物性的影响37-393.4 明胶对铜箔组织性能的影响39-413.4.1 胶原蛋白和骨胶对铜箔毛面组织形貌的影响39-403.

18、4.2 胶原蛋白和骨胶对铜箔物性的影响40-413.5 稀土铈盐对铜箔组织性能的影响41-443.5.1 稀土铈盐对铜箔毛面组织形貌的影响41-423.5.2 稀土铈盐对铜箔力学性能的影响42-443.6 本章小结44-45第4章 正交试验结果与讨论45-604.1 铜箔亮面晶粒微观结构分析45-484.2 铜箔毛面形貌分析48-494.3 铜箔力学性能分析49-514.4 铜箔内应力分析51-574.5 验证试验结果讨论与分析57-584.6 本章小结58-60第5章 结论60-61致谢61-62参考文献62-67攻读学位期间的研究成果67第 7 页 共 7 页免责声明：图文来源于网络搜集，版权归原作者所以若侵犯了您的合法权益，请作者与本上传人联系，我们将及时更正删除。