电子行业专业词汇术语

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1、电子行业专业词汇术语（专业超 全）电子行业专业词汇术语GRR Gauge Repeatability Reproducibility 量测的再现性与再生性FPI First Piece Inspection首件检查Sampling without replacement 不放回抽样 SQA: Source(Supplier) Quality Audit 供货商品 质审核1. QC : quality control 质量管理i=j2. IQC : incoming quality control 进料质量管理3. OQC : output quality control 出货质量管理4. PQ

2、C : process quality control 制程质量管理 也称IPQC : in process quality control .5. AQL : acceptable quality level 允收标准6. CQA: customer quality assurance客户品质保证7. MA : major defeat 主要缺点8. MI : minor defeat次要缺点9. CR :critical defeat关键缺点10. SMT : surface mounting technology 表面粘 贴技术11. SMD :surface mounting devi

3、ce 表面粘贴程nrSMC : surface mounting component 表面 粘贴组件liiJ12. ECN : engineering change notice 工程变更 通知13. DCN : design change notice 设计变更通知14. PCB : printed circuit board 印刷电路板15. PCBA : printed circuit board assembly 装配 印刷电路板16. BOM : bill of material材料清单17. BIOS : basically input and output system 基 本输

4、入输出系统18. MIL-STD-105E :美国陆军标准，也称单次抽 样计划.19. ISO : international standard organization 国际标准化组织20. DRAM:内存条 21. Polarity :电性22.Icicles :锡 尖23.Non- wettin g :空 焊24. Short circuit :短路 25. Missing comp onent : 缺件 26. Wron g comp onent : 错件27 . Excess component :多件28.锡少30. SolderInsuff icient solder29 . E

5、xcessive solder :锡多 residue:锡渣31. Solder ball :锡球32.Tombstone墓碑33 . Sideward:侧立34.Component damage :零件破损35. Gold finger:金手指36. SOP :standard operation process 标准操作流程37. SIP : standard inspection process 标准检验 流程38 .The good and not good segregation :良品和 不良品区分39. OBW : on board writer 熠录 BIOS40 . Simp

6、le random sampling :简单随机抽样41. Histogram :直方图42 . Standard deviation :标准差43. CIP : Continuous improvement program持续改善计划44. SPC : Statistical process control 制程统制45 . Sub-contractors :分包商46. SQE: Supplier quality engineering47. Sampling sample :抽样计划48. Loader :治具49.QTS: Quality tracking system 质量追查系统5

7、1.50. Debug :调试Spare parts:备用品52. Inventory report for : 库存表53. Manpower/Tact estimation 工时预算54. Calibration :校 验64. Base unit :基55. S/N :serial number 序号56. Corrugated pad :波纹垫57.Takeout tray:内包装盒58. Outer box : 外包装箱59. Vericode :检验码60. Sum of square :平方和61. Range :全距62. Conductive bag :保护袋63. Prev

8、entive maintenance :预防性维护体65. Fixture :制具66. Probe :探67. Host probe :主探针68. Golden card : 样 本69. Diagnostics program :诊断程序70. Frame :屏71. Lint-free gloves :静电手套72 .Wrist wrap :静电手环73. Target value :目标值74. Related75. lifted solderdepartment : 浮焊相关部门76.plughole孔 塞77. Wrong direction 极性反ponentdamage or

9、broken零件破损79.Unmelted solder 熔锡不良80.fluxresidue 松香未拭81.wrong label or upside down label 贴反82. mixed parts 机种混装83. poor solder mask 绿漆不良84. oxidize零件氧化85. stand off height 浮高86. ICreverseIC反向87. supervisor 课长88. Forman组长89. WI=work instruction 作业指导90.B.P. 非 擦 除 状态91. Internal notification:内部联络单92. QP

10、:Qualitypolicy 质量政策93. QT: Quality target 品质目标94. Trend:推 移 图95. Paret柏拉图96. UCL: Upper control limit 管制上限97. LCL:Lower control limit 管制下限98. CL: Center line 中 心99. R.T. Rolled throughout yield 直通率100. PPM: Parts per million 不良101. DPU: Defects per unit 单位不良率102. Resistor:电103. Capacitor:电容104. Resi

11、stor array105. Capacitor array:排容106. DIODE:107.SOT:三极管108. Crystal:109. Fuse:保险丝inductance110. Bead:电111. Connector:联结器112. ADM: Administration Department 行政单位113. CE: Component Engineering 零件工程114. CSD :Customer Service Department 客户服 务部 115. ID: Industrial Design 工业设计116.IE: Industrial Engineerin

12、g 工业工程117. IR: Industrial Relationship 工业关系118. ME: Mechanical Engineering 机构工程119. MIS :Management Information System 信 息部 120. MM: Material Management 资材121. PCC: Project Coordination/Control 专案协 调控制122. PD: Production Department 生产部123. PE: Product Engineering 产品工程124. PM: Product Manager 产品经理 12

13、5. PMC: Production Material Control 生产物料管 理126. PSC: Project Support & Control 产品协调127. Magnesium Alloy:镁合金128. Metal Shearing:裁剪IID129. CEM:Contract Electronics Manufacturing 电子制造服务企业EMS: Electronics Manufacturing Services130. ERP: Enterprise Resource Planning 企业 资源规划SCM+CRM+ERP+EAI=Network directT

14、M links procurement, production, Logisticsand sales采购，生产，后勤管理及市场营销的融合EAI: Enterprise application Integration 企业应用系统整合CRM: Customer Relationship Planning 客户服务规划SCM : Supply chain management 供应链 管理131. OJT: On job training 在职培训132. Access Time:光盘搜寻时间133. B2CEC:Business to consumer electronic commerce企

15、业对消费者的电子商务B2BEC:Business to business electronicCommerce企业间的电子商务134. CCL:Copper Clad Laminate 铜箔基板135. Intranet:企业内部通讯网路136. ISP: Internet Service Provider 网络服务提 供者ICP: Internet Content Provider 网络内容 提供者137. GSM: Global System for Mobile Communication泛欧数字式行动电话系统GPS:全球卫星定位系统138. Home Page: 网 络 首 页139.

16、 Video Clip:影像文件140. HTML: 超文标记语言141. Domainname:网域名称142. IP:网络网域通讯协议地址143. Notebook:笔记型计算机144. VR: Virtual Reality 虚拟实境145. WAP: Wireless Application Protocol 无线应 用软件协议146. LAN : Local area network 局域网络WW World Wide Web 世域网WAN: Wide Area Network 广域网络147. 3C: Computer, Communication, Consumer electr

17、onic计算机，通讯，消费性电子三大产品 的整合148.Information Supplier Highway:信息高速公 路149.UPS:Uninterrupted power system 不断电系 统 150.Processed material:流程性材料151. Entity/Item:实体152. Quality loop:质量环153.Quality losses:i=jw154. Corrective action :纠正措施155. Preventive action: 预 防措施156. PDCAlan/Do/Check/Action 计划/实施/检查/ 处理157.

18、Integrated circuits(IC):集成电路158. Application program:应用程序159. Utilities:实 用 程 序160. Auxiliary storage/Second storage:;辅助存储 器161.Siliconchip:硅162Diskette drive:软驱163. Displayscreen/Monitor:显164. Foreground:前面165. Montherboard:母166. Mermory board:内存板167.Slot:插片示器板槽168. Busata-bus/address-bus/Control b

19、us:总线/数据总线/地址总线/控制总线169. Plotter:绘图170. MPC:Multimedia personal computer 多媒171.Oscillator:振 荡 器172. Automatic teller terminal:自动终端（出纳）机173. Joystickport: 控 制 端 口174. VGA: Video Graphics Array 显示卡175. Resolution:分 辨率176. Register:寄存器177.ISA: Industry Standard Architecture 工业 标准结构178.EISA: Extended In

20、dustry Architecture 扩 展工业标准结构179.Adapter:适配器180. Peripheral:外 部 设 备181. Faxmodem :调制解调器181. NIC:Network interface card 网络接口卡182. SCSI: Small computer system interface183. VESA:Video Electronic StandardsAssociation184. SIMM: Single in-line memory module 单排座存储器模块（内存条）185.Casing :外箱 186.Aluminum:铝质187.

21、Ceramic:陶瓷的188.Platter:圆盘片189.Actuator:调节器190.Spindle :轴心191. Actuation arm:存取臂192. Default code:缺省代码 193.Auxiliary port:辅助端口194.Carriage return :回车195. Linefeed:换行197.Video analog:视频模拟196. ASCII: American Standard Code forInformation Interchange美国信息互换标准代198. TTL: Transistor- Transistor logic 晶体管-晶

22、体管逻辑电路199. Three-prongplug:三芯电插头200. Female connector:连接插座201. Floppydisk:软202.Output level:输出电平203.Vertical/Horizontal synchronization:场/行 同步204.H(Horizontal)-Phase:行相位205. Compatible:兼 容 机206. Hardware Expansion Card:硬件扩充卡缓冲relationship Management207. Buffer:in process 半成品208. CRM:Customer 客户关系管理2

23、09. WIP:Work210. Waiver:特别采用211. CXO 系列一CEO: Chief Executive Office 首席执政官；执行总裁COO: Chief Operating Office CFO: Chief Finance Officer CBO: Chief Business Officer CTO: Chief Technology Officer CIO: Chief Information OfficerCGO: Chief Government Officer212. NASDAQ:纳斯达克证券市场 NASDAQ Automated Quotation sy

24、stem213. VC: Venture Capital 风险投资214. PDA: Personal Date Assistant 个人数字助 理PLA: Personal Information Assistant 个人 信息助理215. PPAP: Advanced Product Quality Planning and Control Plan 生产性零组件核准程序216. FMEA: Potential Failure Mode and EffectsAnalysis失效模式与效应分析217. MSA: Measurement Systems Analysis 量测 系统分析218

25、. QAS: Quality System Assessment 质量系统评鉴219. Cusum:累计总合图220. Overall Equipment Effectiveness 设备移动 率221. Benchmarking:竞争标杆Analysis ofmotion/Ergonomics动作分析/人体工程学222. Roka Yoke 防错法MCR:machine capability ratio 机器利用率223. Mistake Proofing防呆法Taguchi methods 田口式方法224. Vertical integration 垂直整合 Surveillance定期

26、追踪审查225. EMS:ElectronicsManufacturingSupply-chain226. Cause & Effects charts 特性要因图227. Scatter:散布图Fool-ProofSystem防呆系统228. VE: Value Engineering 价值工程 QFD: Quality Function Development 质量机能展开229. Arrow Chart 箭头图法AffiliateChart亲和图法230. PDPC: Process Decision Program Chart System Chart系统图法Matrix231. Re

27、lation Chart 关边图法Chart矩阵图法232. Matrix Data Analysis 矩阵数据分析法JIT: Just In234. Brain-storm 脑风暴法Time:及时性生产模拟Prototype 技235. Deming Prize:戴明奖术试作236. BPM: Business Process Management 业务流程管MBO目标管理237. MBP:方针管理FTA:故障树分析i=jQSC服务质量238. IPPB: Information 情况 planning 策 划 Programming 规划 Budget 预算239. EQ: Emotion

28、 Quotient: 情 商IQ: Intelligence Quotient:智商240. Implied Needs:隐含要求 Specified Requirement:规定要求241. Probation:观察期IncomingProduct released for urgent production 紧急放 行242. Advanced quality planning先进的质量策划l=j243. AOQ: Average Outgoing Quality 平均检出 质量l=jwAOQL: Average Outgoing Quality Limit 平均检出质量界限经核准认可的供

29、244. Approved Supplier List 应商名单特 征Calibration 校245. AttributedateBenchmarking 基准点 准246. Capable process 工序能力 Capability Index序能力指数 Capability ratio工序能力 率247. CHANG CYCLE TIME 修改的时间周期Continuous improvement 持续改进l=J248. Control plans 控制策划 Cost of quality 质量成本249. Cycle time reduction 减少周期时间250. Design

30、 of experiments 实验设计 Deviation / Substitution 偏差/置换251. ESD: Electrostatic discharge 静电释放252. EH&S: Environmental, Health, and Safely 环境，健康.安全253. ESS: Environmental Stress Screening 环境 应力筛选254. FMEA: Failure Mode Effect Analysis 失误模式效应分析255. First Article approval 产品的首次论证256. First pass yield 一次性通过

31、的成品率257. First sample inspection 第一次样品检验258. FMECA: Failure mode effect and critically analysis失误模式,效应及后果分析I=Jw259. Gauge control测量仪器控制l=Jw260. GR&R: Gauge repeatability and reproducibility测量仪器重复性和再现性261. HALT: Highly Accelerated Life Test 高加速寿命试验262. HAST: Highly Accelerated Stress Test 高加速应力试验263.

32、 IN-CONTROL PROCESS 受控制工序264. INDUSTRIAL AVERAGE 工业平均数265. JIT (just in time) manufacturing (实时)制程266. Key characteristic 关健特征267. Key component 关健构件268. Life Testing 寿命试验i=jw269. Lot traceability 批量可追溯性270. Material review board 原材料审查部门 MCR: machine capability ratio 机械能力率272.274.271. NONCONFORMANCE

33、 不符合 OUT-OF-CONTROL PROCESS 失控工序 273. Pilot Application 试产(试用) PPM: Parts per million 百万分之一275. Preventive VS detection 预防与探测 Preventive maintenance 预防维护276. Process capability index 工序能力指277. Process control 工序控制279.278. Process improvement 工序改进 Process simplification 过程简化l=Jw280. Quality Clinic Pr

34、ocess Chart (QCPC)质量 诊断过程图l=Jw281. Quality information system 质量资料体系282. Quality manual 质量手册283. Qualityplan质 量计划284. Quality planning 质量策划285. Qualitypolicy质量方针286. Quality system 质量体系287. Reliability 可靠性RUN Chart 趋势表288. Skill Matrix 技能表289.Statistical quality control (SQC)统计质量控制290. Teamwork 团队工作

35、291. Totalquality management全面质量管理292. Variable data 变量数据i=jw293.Variation影响变量294. Value Analysis值分析295. Visual Factory 形象化工厂296. Survey Instructions调查指引297. Profile 概况298. Improvement Plan改进计划299. Evaluation 评估300. implementation实施301. Compliance 符合302. Supplier Audit Report 供方审核报告303. Site Audit 现

36、场审核304. Typical agenda典型的议事日程305. Internal and external failure costs 内部和外 部的失误成本306. Failure rate percentage 失误百分率307.Productivity (output / input)生产率(产出/投入)308. Customer complaints 客户投诉309.Customer satisfaction indices 客户满意度指数 310. Root cause analysis of failures 失误根原分析 品管中英文名词对照表Accuracy准确度 Activ

37、e主动Action评价.处理 Activity活动 Add加Addition rule 加法运算规则 Analysis Covariance 协方差分析 Analysis of Variance 方差分析Appraisal Variation 评价变差Approved 承认ASQC美国质量学会Attribute计数值Audit 审核Automatic database recovery 数据库错误自动回复Average平均数balance平衡Balance sheet资产负债对照表Binomial二项分配Body机构Brainstorming Techniques 脑力风暴法 Business

38、 Systems Planning 企业系统规划 Cable 电缆 Capability 能力 Cause and Effect matrix因果图.鱼骨图Center line 中心线 check 检查 CheckSheets 检查表 Chi-square Distribution 卡方分布11Clutch spring离合器弹簧Coining压印加工 Common cause 共同原因 Complaint 投诉 Compound factor 调合因 素 Concept新概念 Condenser聚光镜 Conformity 合格 Connection 关联 Consumer s risk消

39、费者之风险Control控制 Control characteristic 管制特性Controlchart管制图 Control plan管制计划 Correction 纠正Correlation Methods相关分析法Cost down降低成本连续工CPI: continuouse Process Improvement 序改善Creep渐变Cross Tabulation Tables 交 CS: customer Sevice 客户中心 Cushion缓Customer 顾客 DSA: Defects Analysis System 缺陷分析系统 Data数据 Data Collec

40、tion 数 据 收 集 Data concentrator资料集中缓存器unit单位缺点数难检度数字of Experiments 实验设计否Engineering recbnology 工程技术Entropy函Environmental 环境Equipment设DCC: Document Control Center 文控中心 Decision决策.判定 Defects per Description 描述 Detection Device装置 Digital Do执行 DOE: Design Element 元素 ElseEstimated accumulative frequency 计

41、算估计累、r归,计数E Equipment Variation 设备变异Event事件External Failure外部失效，外部缺陷FA: Failure Analysis 坏品分析Fact control 事 实 管 理Fatique 疲劳FMEA: Failure Mode and Effect analysis 失效 模式与效果分析FPY合格率function 职能Gum-roll橡皮滚筒Histogram直方图FQA: Final Quality Assurance 最终品质保证 FQC: Final Quality control 最终品质控制 Full-steer完全转向 Ga

42、uge system量测系统 Grade等级 Health meter 体重计 Heat press冲压粘着 Hi-tech高科技 hypergeometric 超几何分配hysteresis 磁滞现象 Improvement改善Inductance 电感Information 信息Initial review先期审查Inspection 检验Internal Failure内部失效，内部缺陷 IPQC: In Process Quality Control 制程品质控制 IQC: Incomming Quality Control 来料品质控制 IS International Organi

43、zation for Standardization国际标准组织 Law of large number 大数法则Link连接 LCL: Lower Control limit 管制下限 LQC: Line Quality Control 生产线品质控制 LSL: Lower Size Limit 规格下限i=jwMachine 机械 Manage 管理 Materials 物 料 Measurement量测 Median中位数 Miss feed 漏送 Module,sub-system,sub-unit 单 位 Momentum原动力Monte garlo method原子核分裂热运动法l

44、=JwMSA: Measurement System Analysis 量测系统 分析Multiplication rule乘法运算规则Normal常态分NIST美国:标准技术院 布Occurrence发生率OperationOrganization 组织Parto柏拉图On.off system 开,关系统Instruction作业指导书Parameter 参数Parts 零件 Parts per million 不良率Passive消极的，被动的 Plan计划Pulse脉冲 Policy方针Population群体Power力量，能源PQA: Process Quality Assuran

45、ce 制程品质保证 Practice 实务Precision 精密度preemptive 先 占式多任务Pressure 压缩Prevention 预防Probability 机率Probability density function 机率密度函数Procedure 流程Process 过程Process capability analysis 制程能力分析图Process control and process capability 制程管制 与制程能力ProductProducer s risk生产者之风险 产品Production生产ProjectsProgram 方案 项目 QA:

46、Quality Assurance 品质保证QC: Quality Control 品质控制QE: Quality Engineering 品质工程QFD: Quality Function Desgin 品质机能展开i三wQuality 质量Quality manual 品 质Quality policy 品质政策Random experiment 随 机Random numbers 随机数Reflow 回Range全距 Record记录 流Reject拒收 Repair返修ReproducibilityRequirement 要求Response 响应Reword返工 Rolled yie

47、ld 直通率 Number风险系数liiJ样 本 空 间Repeatusility 再现性 再生性 Residual 误差 Responsibilities 职责 Review评审 Robustness 稳健性 RPN: Risk Priority sample抽样，样本 Sample space Sampling with replacement 放回抽样Sampling without peplacement 不放回抽样 Scatter diagram散布图分析Scrap 报废 Screw 螺旋Severity严重度Shot-peening微粒冲击平面法Simple random samp

48、ling 简单随机取样 Size规格SL: Size Line规格中心线Slip 滑动StratifiedSpecification 规random sampling分层随机抽样 SOP: Standard Operation Procedure 标准作业 书 SPC: Statistical Process Control 统计制程 管制 Special cause特殊原因范SQA: Source(Supplier) Quality Assurance 供货 商品质保证Stage sampling分段随机抽样Standard Deviation 标准差Sum ofsquares统计表supp

49、lier平方和System 供方systematic sampling 系统，体系Statistical tables系统抽样Technical Test piece测试片 stamp时间戳印Torque转矩TimeTitle 题TQC: Total Quality Control 全Taguchi-method 田口方法 committees技术委员会 Theory原理 Time-lag 延迟 Total求和 面品质控制Transaction processingTrouble 困扰 UCL: Upper ControlTQM: Total Quality Management 全面品质管理

50、 Traceablity 追溯 Training 培训 and logging交易处理 Up and down上和下 Limit管制上限 USL: Upper Size Limit 规格上限Validation确认Variable计量值Variance变异和Vector 向量 Verification 验证 Version版本VOC: voice of Customer 客户需求VOE: Voice of Engineer 工程需转帖电子行业相关的英语词汇-1 backplane背板2 Band gap voltage reference 带隙电压参考3 benchtop supply 工作台

51、电源4 Block Diagram 方块图5 Bode Plot 波 特 图6 Bootstrap 自举7 Bottom FET Bottom FET8 bucket capcitor 桶形电容9 chassis机架10 Combi-sense Combi-sense11 constant current source 恒流源12 Core Sataration 铁芯饱和13 crossover frequency交叉频率14 current ripple 纹波电流15 Cycle by Cycle逐周期16 cycle skipping 周期跳步17 Dead Time 死区时间18 DIE

52、 Temperature 核心温度2019 Disable非使能，无效，禁用，关断 dominant pole 主极点21 Enable 使能，有效，启用22 ESD Rating ESD 额定值23 Evaluation Board 评估板24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characte

53、ristics section is not implied. 超过下面 的规格使用可能引起永久的设备损害或设备故 障。建议不要工作在电特性表规定的参数范围以 外。25 Failling edge 下 降26 figure of merit 品质因数27 float charge voltage 浮充28 flyback power stage 反驰式功率级29 forward voltage drop 前向30 free-running 自由运行31 Freewheel diode 续流 二32 Full load 满负载33 gate drive 栅 极 驱 动34 gate drive

54、stage 栅极驱动级35 gerber plot Gerber 图36 ground plane 接地层37 Henry 电感单位：亨利38 Human Body Model 人体模式39Hysteresis滞回40 inrush current 涌入电流41Inverting反相42 jittery 抖动43Junction结点44 Kelvin connection 开尔文连接45 Lead Frame 引脚框架46 Lead Free 无铅47level-shift电平移动48 Line regulation 电源调整率49 load regulation 负载调整率50 Lot Nu

55、mber 批号51LowDropout低压差52 Miller 密勒53node节点54 Non-Inverting 非反相55 novel 新 颖 的56 off state关断状态57 Operating supply voltage 电源工作电压58 out drive stage输出驱动级59 Out of Phase 异 相60 Part Number产品型号61 passtransistor pass transistor62 P-channel MOSFET P 沟道 MOSFET63 Phase margin相 位裕度64 Phase Node开关节点65 portable e

56、lectronics便携式电子设备66 power down 掉电67 Power Good 电源正常68 Power Groud 功率地69 Power Save Mode节电模式70 Power up 上电71 pulldown下拉72 pull up 上拉73 Pulse by Pulse 逐脉冲(Pulse by Pulse)74 push pull converter 推挽转换器75 ramp down 斜 降76 ramp up 斜升77 redundant diode 冗余二极管78 resistive divider 电阻分压器79 ringing 振铃80 ripple cu

57、rrent 纹波电流81 rising edge 上 升 沿82 sense resistor 检测电阻83 Sequenced Power Supplys 序列电源84 shoot-through直通，同时导通85 stray inductances.杂散电感86 sub-circuit 子电路87 substrate基板88 Telecom 电信89 Thermal Information 热性能信息90 thermal slug 散热片91 Threshold阈 值92 timing resistor 振荡电阻93 Top FETTop FET94 Trace线路，走线，引线95 Tra

58、nsfer function 传递函数96 Trip Point 跳变点97 turns ratio 匝数比，=Np / Ns。（初级匝数/ 次级匝数）98 Under Voltage Lock Out (UVLO)欠压锁定99 Voltage Reference 电压参考100 voltage-second product 伏秒积 101 zero-pole frequency compensation 零极点频率 补偿102 beat frequency 拍频 shots单击电路 104 scaling 缩放 等效串联电阻106 Ground地电位 trimmed bandgap 平衡带隙

59、 108 dropout voltage 压差 bulk capacitance大容量电容 110 circuit breaker 断路器 charge pump 电荷泵 112 overshoot 过冲103 one105 ESR107109 large1111)元件设备三绕组变压器：three-column transformer ThrClnTrans双绕组变压器：double-column transformer DblClmnTrans并联电容器：电抗器：Reactor输电线：发电厂：power刀闸（隔离开关）:电动机：motor电容器：Capacitor shunt capacit

60、or 母线：Busbar TransmissionLine plant 断路器：Breaker Isolator分接头：tap （2）状态参数无功：reactive有功：active powerpower电流：currenti=jw容量：capacity电压：voltagereactive loss无功损耗：active功率因数：power-factorpowerpower-angle电压等级：voltage空载损耗：no-load lossiron loss铜损：copper loss档位：tap position 有功损耗：loss功率：功角：grade铁损：空载电流：no-load current 阻抗：impedance正序阻抗：positivesequence impedance负序 阻抗： negative sequence impedance 零序阻抗：zero sequence impedance电阻：resistor电抗：reactance电导：conductance电纳：susceptance无功负载:reactive loa