杜邦产品介绍(3)

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1、Introduction to Flexible Circuit MaterialsPresented by:Jonathan C.LimPart II:(40 minutes)簡報大綱簡報大綱 軟性電路板基材之介紹 基材的主要Composition Dielectric Substrates(絕緣體)Adhesive(膠質)Conductor(導體)m簡報大綱簡報大綱(continue)杜邦產品 壓克力膠系列(Modified WA Acrylic)之基材 環亞樹脂膠系列(Modified Epoxy)之基材 杜邦 料號解說 Pyralux Telcamm軟性電路板之主要基材軟性電路板之主要

2、基材 Copper Clad Laminates(銅箔基材)Single-Sided C.C.L.(單面銅箔基材)AdhesiveConductorDielectric Substratem Double-Sided C.C.L.(雙面銅箔基材)ConductorDielectric SubstrateAdhesive軟性電路板之主要基材軟性電路板之主要基材m Adhesive-Less C.C.L.(無膠銅箔基材)Dielectric SubstrateConductor軟性電路板之主要基材軟性電路板之主要基材m Coverlay(覆蓋膜)軟性電路板之主要基材軟性電路板之主要基材mDiele

3、ctric SubstrateAdhesive離型紙離型紙AdhesiveKapton Stiffner(補強材)軟性電路板之主要基材軟性電路板之主要基材Dielectric SubstrateAdhesivem BondplyDielectric SubstrateAdhesiveAdhesive軟性電路板之主要基材軟性電路板之主要基材mMylarAdhesiveKaptonAdhesive Sheet Adhesive PhotoImageable Coverlay(PIC)Dry Film Fine-Line Application Camera Automotive Others軟性電

4、路板之主要基材軟性電路板之主要基材mDielectric Substrates Definition A base film on which the printed conductors are laid.A film which provides electrical insulation between conductors.A film which provides mechanical strength of the circuit.m 必備之特性 Mechanical Strength Flexibility Dimensional Stability Dielectric Pro

5、perties Thermal Properties Chemical Resistance Moisture Absorption CostDielectric Substratesm Substrates 之種類 Polyimide Polyester Fluorocarbon Aramid Paper CompositeDielectric Substratesm Polyimide:Popularized by DuPont under“Kapton”Also known as PI First choice of film in most FPC Infusible and flam

6、e retardant High Tg(約 260C-280C)Good dimensional stabilitySubstratesmSubstrates Polyester:Popularized by DuPont under“Mylar”Also known as PET Lowest cost dielectric material Mostly used in low-cost consumer application Good mechanical properties Bad thermal propertiesmSubstrates Aramid Paper:Sold un

7、der DuPont trade name“Nomex”Used in specialized application Good thermal insulation materialmProperty Polyester Polyimide Fluorocarbon Aramid Paper CompositeTensile Strength Excellent Excellent Fair Good BestFlexibility Excellent Excellent Excellent Good Fair/GoodDim.Stability Fair/Good Good Fair Go

8、od Fair/GoodDielectric Str.Good Good Very Good Very Good GoodSolderibility Poor Excellent Fair Excellent ExcellentC.O.T.(C)105 200-230 150-180 220 105-180Thermal Exp.Low Low High Moderate LowChem.Resist.Good Good Excellent Very Good FairMoisture Absorp.Very Low High Very Low Very High LowCost Low Hi

9、gh High Moderate ModerateTrade Name Mylar Kapton Teflon/Tedlar NomexDielectric SubstratesmAdhesive Definition Material that bonds layers together Thermosetting ThermoplasticmAdhesive 必備之特性 Adhesion Strength Flexibility Chemical Resistance Thermal Resistance Moisture Absorption Electrical Properties

10、CostmAdhesive Adhesive之種類 Polyester Acrylic Epoxy Polyimide Butyral PhenolicmAdhesive Polyester:Used where the dielectric is also polyester Used where no soldering is needed Typical application:Instant camera film interconnects Instrument cluster connection in automobilesmAdhesive Acrylic:Used in de

11、manding temperature requirement application Most popular acrylic system is Pyralux by DuPont Excellent adhesionmAdhesive Epoxy:Widely used adhesive system Generally lower cost than acrylic Able to stand wave soldering Good in high temperature for long period of time(400 to 450 F)mAdhesive Polyimide:

12、Used in adhesiveless ccl and coverlay Used where dimension stability is critical Used in high temperature application High moisture absorptionmAdhesivePolyesterAcrylic EpoxyPolyimideButyral PhenolicTemp.Resist.Chem.Resit.Elec.Prop.AdhesionFlexibilityCostMoisture FairGoodExcellentExcellentExcellentLo

13、wFairVery GoodGoodGoodExcellentVery GoodGoodGoodGoodGoodGoodExcellentExcellentExcellentGoodGoodGoodGoodGoodGoodModerateFairFairVery HighPoorFairFairHighModeratePoormConductors/Foil Major types of conductors Metals Metal alloys conductive inks Copper(the most commonly used conductor in FPC)Electrolyt

14、ically deposited copper(ED)Rolled Annealed copper(RA)mConductors/Foil 必備之特性 Current-carrying capacity Flexibility Service temperature Chemical resistance Mechanical strength CostmConductors/FoilElectrical PropertiesThermal PropertiesMechanical PropertiesRelative CostAluminumCopperGoldNickelSilverExc

15、ellentGoodExcellentExcellentExcellentExcellentExcellentExcellentGoodGoodGoodGoodGoodFairFair/GoodFairFairVery GoodVery GoodBestm軟板基材製造過程軟板基材製造過程Copper RollKapton RollCopper Clad LaminateHeater 1Heater 2Liquid AdhesiveAgingmIntroduction to DuPont ProductsmPart III:(15 minutes)DuPont Product Family Py

16、ralux Pyralux FR Pyralux LF Pyralux AP Pyralux PC Teclam Teclam FNC Teclam DNCPyralux FR-series(Acrylic Based)Copper-Clad Laminates Panel Form Packaging.(24”x 36”)UL Approved.(File#E124294)Very Good Flexure Endurance Ex.FR9111,FR9110,FR8510,FR8515 Coverlay Roll Form Packaging.(24”x 250)UL Approved.(

17、File#E124294)Excellent Dimensional Stability Ex.FR0110,FR0210mPyralux FR continue.Sheet Adhesive Roll Form Packaging.(24”x 250)UL Approved Ex.FR0100,FR0200 Bond Ply Roll Form Packaging.(24”x 250)UL Approved Ex.FR0111,FR0212mPyralux LF-series(Acrylic Based)Military Specifications Excellent Flexure En

18、durance Very Good for High-Density Circuitry Same Product Offerings as FR-series PC-series(Acrylic,urethane,&imide-based)Dry Film Photoimageable Coverlay Cameras&Automotive ApplicationsmPyralux P/NsFR 9 111CuPICu7 -Special construction8 -1/2oz.C.C.L.9 -1oz or more C.C.L.5 -1/2 oz.Cu1 -1 oz.Cu2 -2 oz

19、.Cu1 -1 mil PI2 -2 mil PI3 -3 mil PIFRLFAPCopper-Clad LaminatesmPyralux P/NsFR 0 111Adh.PIAdh.FRLFAP7 -Special construction0 -Coverlay or Sheet Adhesive1 -1 mil adhesive2 -2 mil adhesive3 -3 mil adhesive1 -1 mil PI2 -2 mil PI3 -3 mil PICoverlay&Sheet AdhesivemTeclam FNC-series Copper-Clad Laminates

20、UL Approved Good Flexure Endurance Roll Form Packaging(250/500mm x 100M)Ex.FNCRA110,FNC110 Coverlay UL Approved Roll Form Packaging Ex.FNCC510,FNCC510-20m DNC-series UL Approved Least Repellency Good Peeling Strength Excellent Heat&Humidity Resistance Excellent Transparency Same Product Offering as FNCTeclam mTeclam CoverlayFNCC510-20FNCDNCC -Coverlay5 -Coverlay1 -1 mil PI2 -2 mil PINo Meaning15 -15m Adhesive20 -20m Adhesive35 -35m AdhesivemTeclam Copper-Clad LaminatesFNCRA910FNCDNCRA -RA Cu.-ED Cu.1 -1 mil PI2 -2 mil PI7 -1/2 mil PI1 -1 oz.Cu.2 -2 oz.Cu.9 -1/2 oz.Cu.mQ&AmPart IV:演讲完毕，谢谢观看！