00138LeadFreeElectronicsTheyreHeretoStay

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1、Lead-Free Electronics:Theyre Here to StayChris JorgensenIPC Technical Project ManagerLead-Free Electronics:Positioning Massachusetts Companies as Industry Leaders North Andover,Mass.April 13,2000Overviewu10,000 tons of SnPb solder used annuallyuPb indicated as a hazardous elementFLegislative action

2、has pushed for its removalGPlumbing solders and tin cansGHousehold paintsGBulletsFUS electronics industry currently exempted from legislationuIndustry lulled to sleep.OverviewWAKE UP CALL!uEuropean legislationuStepped-up efforts by Japanese OEMsuNIST-US industry stands to lose$420 billion in three-y

3、ear period following 2002 unless it has a competitive edge(NIST ATP Web site)uNow what?Overviewu IPC Board of Directors Position StatementThe US electronic interconnection industry,represented by the IPC,uses less than 2%of the worlds annual lead consumption.Furthermore,all available scientific evid

4、ence and US government reports indicate that the lead used in US printed wiring board(PWB)manufacturing and electronic assembly produces no significant environmental or health hazards.Nonetheless,in the opinion of IPC,the pressure to eliminate lead in electronic interconnections will continue in the

5、 future from both the legislative and competitive sides.IPC encourages and supports research and development of lead-free materials and technologies.These new technologies should provide product integrity,performance and reliability equivalent to lead-containing products without introducing new envi

6、ronmental risks or health hazards.IPC prefers global rather than regional solutions to this issue,and is encouraging a coordinated approach to the voluntary reduction or elimination of lead by the electronic interconnection industry.Worldwide ActivitiesPolitical ActivitiesuJapanFMITI take-back legis

7、lation 1997FJapanese Home Electronic Recycling LawGRevised in 1998GHousehold appliance recycling in full force by April 2001uSwedenFRecommends lead phase-out by 2020uDenmarkFProhibits import,sale and production of products containing metallic lead Political ActivitiesuEuropean Commission(EC)Waste El

8、ectrical and Electronic Environment(WEEE)DirectiveFCalls for lead ban in most electronics by 2004FDelegate General(DG)-Environment:Industry is the problem and the solution FFourth draft stalled due to changes in European Commission(EC)FFourth draft scheduled for availability late April 2000Political

9、 ActivitiesuWEEE Directive ExemptionsFLead as an element in some alloysGSteel-Containing up to 0.3%lead by weightGAluminum-Containing up 0.4%by weightGCopper-Containing up to 4%lead by FLead in electronic partsPolitical ActivitiesuUSFReid Bill-1991FLead Exposure Reduction Act-1993FEPA proposed repor

10、ting requirements for lead usage limits from 25,000 lbs.to 10 lbs.-1999GIPC opposes this proposalGCould prove very costly to smaller companiesGReconsidering small business impactGStaying focused on these activitiesPolitical ActivitiesuUS StatesFCaliforniaGProposition 65-Safe Drinking Water and Toxic

11、 Enforcement Act of 1986FConnecticutGDepartment of Environmental Protection(DEP)plans to issue general permit for recycling electronics this yearFSouth CarolinaGState legislature evaluated a bill to establish a statewide electronic equipment recycling program.Marketing/Competitive PressuresuJapanFHi

12、tachiGLead usage in 1999 50%of that of 1997GAll products lead free by 2001GInvesting 1.2 billion Yen($11.2 million)to expand production of lead-free solderFMatsushita(Panasonic)GLead solder to be removed in 2000 from consumer electronicsGAll consumer electronics to be lead free by 2001GWill begin ma

13、rketing products in USFToshiba GLead removed from all cell phones by 2002Marketing/Competitive PressuresuJapanFSony GLead usage in 1999 50%of that of 1996GLead removed from all products except high-density packaging by 2001GTold its 500 suppliers to provide lead-free productsFNEC GLead usage by 2002

14、 50%of that used in 1997GCurrently using lead-free semiconductorsGBegan shipping lead-free product in JanuaryGLabeling lead-free from lead bearing productsMarketing/Competitive PressuresuUSFMonitoring Japanese and European activitiesFResearching alternativesFPrefer product-by-product switch rather t

15、han overall requirementFDont want marketing to drive legislationOrganizational ActivitiesuIPCFwww.leadfree.orgGOver 4000 visitors since August 1999GLead Free GrapevineGTechnical papers and articlesGHost to IPC Roadmap for Lead-Free Electronics AssembliesG2nd and 3rd drafts downloaded over 2000 times

16、FLeadfreeipc.orgGE-mail forum for peer interaction G500+subscribers GAnnouncements for future roadmap meetingsOrganizational ActivitiesuIPCFInternational Summit on Lead-Free Electronics AssembliesG500+attendeesG35 presentations over five sessionsGInitial roadmap developmentGProceedings include updat

17、ed presentationsFAPEX 2000GTechnical forums,conference and roadmap workOrganizational ActivitiesuEIAFSupports further research that could lead to minimizing lead use in the electronics industry,including the funding of a university-affiliated research programuNIST-ATPFLucent EC&S project for drop-in

18、 replacement-1999GOn target for 2001 completionOrganizational ActivitiesuNCMSFLead-Free Solder Project-1997GCollaborative effort of OEMs,academia and laboratoriesGTested 27 candidate alloysGFound no drop-in replacement,but resulted in good dataFHigh-Temperature Solder ProjectuNEMIFNorth America need

19、s to prepare to deliver lead-free products by 2001,with an“eye”for total lead elimination for 2004.FProposed replacement alloysOrganizational ActivitiesuInternational Tin Research Institute(ITRI)-SOLDERTECFStandardize lead-free materialsFCollaborative research effortsFOver 10 years of lead-free rese

20、archFSponsors include alloy suppliers and OEMsuIDEALS ProjectuConducted by European companiesuProduction-ready processes for lead-free electronicsuReliability of final assembliesOrganizational ActivitiesuJapan Institute for Electronic Packaging(JIEP)First adoption of lead-free solders in massproduce

21、d goods1999Adoption of lead-free components2000Adoption of lead-free solders in wave soldering2000Expanded use of lead-free components2001Expanded use of lead-free solders in newproducts2001General use of lead-free solders in new products2002Full use of lead-free solders in all new products2003Lead-

22、containing solder used only exceptionally2005Complete elimination of lead from electronicproducts2007IPC Roadmap FindingsLead-Free Solder SelectionuSnAgCuFAppears to be most popular candidate-with or without the addition of a 4th elementFChosen as benchmark for testing-SnPb is the baselineFConcernsG

23、Higher processing temperaturesGHigher temperatures leads to more energy used-added costGCompatibility with some lead bearing finishesGToxicity of AgLead-Free Solder SelectionuSnCuFLow-cost alternative for wave solderingFCompatible with most lead bearing finishesFConcernsGHigher processing temperatur

24、es than most SnAgCu alloysuSnAgBiFCandidate for SMT applicationsFNCMS study showed better thermal cycle reliability for certain SMT than SnAgCuFConcernsGToxicity of Bi and AgGFillet liftingLead-Free Solder SelectionuSnZnFLow melting temperatureFLong-term data neededFConcernsGZn oxidationGLong-term c

25、orrosion of solder jointGRequires special flux chemistriesGWetting characteristics not as good as SnAgCuLead-Free Solder SelectionuSnAgFLong history of usageFExtensive data-attractive to most companiesFConcernsGHigher melting temperatures than SnAgCuGToxicity of AgLead-Free Solder SelectionuAlloys b

26、y area of industry usedALLOYS USEDMELTING RANGE(C)INDUSTRY SERVEDCOMPANYSnAg221-226AutomotiveVisteon(Ford)Military/AerospacePanasonicSnAgBi206-213ConsumerHitachiSnAgBiCuMilitary/AerospacePanasonic(FA Controller?)SnAgBiCuGeConsumerSonySnAgBiX206-213ConsumerPanasonicAutomotivePanasonicNokiaNortelPanas

27、onicSnAgCu217TelecommunicationsToshibaSnBi138ConsumerPanasonicConsumerPanasonicSnCu227TelecommunicationsNortelNECPanasonicSnZn198.5ConsumerToshibaLead-Free Solder SelectionuFluxesFSelection of lead-free alloy means changes in flux chemistriesFDont plan on plugging current flux into new processFWill

28、have to tweak chemistries for high-temperature solderingFWill need totally new flux if using SnZnFChanging flux chemistry affects cleaning processes,soldermask and coatingsLead-Free ComponentsuMolded ComponentsFConcerns with popcorning and delaminationFNeed time GQualification of new componentsGDefi

29、nition of new materialsGNew molding compoundsFNew compounds need to meet high-temp requirementsFCompounds should meet WEEE halogen free requirementsFJ-STD-020 and J-STD-033 revisions in processLead-Free ComponentsuMolded componentsFManufacturing experiences and concerns of finishesFinishManufacturin

30、gExperienceConcernsNiPdYesMaterial cost(Process is cheaper;must switch 100%)NiPdAuYesMaterial costSnBiNoThe assembly must be totally Pbfree.SnYesTin whiskersSnCuYesTin whiskersLead-Free ComponentsuDie attachFAuSi eutecticGNot applicable to large die because its brittleGTends to crack large silicon d

31、iesFAuSn eutectic GMelts at 180GDefinition of new materialsGFor new molding compoundsFNew compounds need to meet high-temp requirementsFCompounds should meet WEEE halogen free requirementsFOrganic can use Ag-filled epoxyLead-Free ComponentsuFlip chip/CSPFNo known solutionGInternal to packageGTempera

32、ture hierarchyFPotential for use of patented Indium alloy or SnAgCu for direct chipFSome in industry may propose exemption for these partsLead-Free ComponentsuConnectors and through holeFMaterials same as molded componentsFMore data needed before making specific determinationsuBGAFForm balls with Sn

33、AgCuGNeed to pay attention to affects of high-temperature solderGConcerns with warpage of BGAsFVery little data currently available,but being gathered by NEMI and othersPWBsuOrganic Solderability Preservatives(OSPs)FViable candidateGEasily processableGRelatively free of ionic contaminantsGFlatter th

34、an HASLGGood solderabilityFConcernsGStorage lifeGNeed to handle with careGDurability with high melting temperaturesGNeed to assess flux chemistries usedPWBsuLead-Free Hot Air Solder Leveling(HASL)FViable candidateGWorks well with most alternative soldersGWets faster than most plated finishes and coa

35、tingsFConcernsGWarpage due to higher processing temperaturesGPWB-absorbed process chemistriesGRoundness of finish makes it hard to use with small leadsGSafety issues with high-temperature soldersFSome manufacturers may move away from HASL altogether if required to go lead freePWBsuImmersion Finishes

36、(Precious Metals)FViable candidateGSurface flatnessGAvailabilityGEase of processFConcerns with thinness of coatingsGHigh soldering temperatures may result in out-diffusion of base metals and oxidationGReduced solderabilityPWBsuElectroless NiAuFViable candidateGResistant to damage during handlingGImp

37、roved shelf life over other finishesGFree of ionic contaminantsGCompatible with most flux chemistriesGFlatter than HASLPWBsuMaterials ConsiderationsFReliability in processingGWarpage of PWBGMust be able to survive multiple reflowsGHigh Tg doesnt necessarily mean laminate can survive high soldering t

38、emperaturesGPTH reliabilityGHigh-temperature reflows also affect inks,adhesives and markingsEquipmentuNew Equipment ConsiderationsFSolder potsFReflow ovensFConcernsGCost of new equipmentGDowntime for transition and training staffGSpace limitationsFMay not be necessary in all casesWhen Given Lemons,M

39、ake LemonadeRoadblocks and ResolutionsuLack of singularity of alloyFIndustry needs to continue consortia efforts in down-selection of alloysuRework and repair impactFNeed markings to indicate board is lead freeuRecycling requirementsFMonitor state-level activitiesFCall upon consortia to make require

40、mentsuWorker safety/exposure issuesFNeed data from EPAs DfE ASF projectRoadblocks and ResolutionsuNo definition for lead freeFCall on IPC membership to take initiative FPossibly 0.1%?uLack of industry partnershipFContinue efforts through consortia activities,such as roadmap developmentuNeed to know

41、process requirementsFIndustry must share experiencesFGo to suppliers for informationFIndustry-sponsored lead-free assembly trainingRoadblocks and ResolutionsuNeed to know process requirementsFIndustry must share experiencesFGo to suppliers for informationFIndustry-sponsored lead-free assembly traini

42、nguLack of reliability and long-term dataFSharing of dataFConsortia must team togetherFAccept or develop data for specific applicationsFFocus on what data is neededFDissemination and acceptance of dataRoadblocks and ResolutionsuToxicity/environmental impact of alternatives not clear FNeed data from

43、EPAFCare in selecting an alternative that wont face potential banuNo government pressure in US to switch to lead freeFTo preclude an possible legislative activities,industry should take the initiative to research alternatives in anticipation of US legislationRoadblocks and ResolutionsuSlow pace of s

44、tandards developmentFRigorous streamlining of standards revision processFStandards revision must focus on lead-free as a priorityFIntensify liaison work with international associationsFIndustry sectorization of standards and specifications(i.e.,telecommunications,automotive)The Path AheaduIPC will r

45、emain active in lead free arenaFMustnt allow industry to forget againFContinue to provide informationFPeriodic roadmap updatesuIndustry needs to be preparedFLegislation may hit US shoresGIPC will not oppose any legislationFJapanese lead-free consumer electronics to be released in US-This year!Do you want to be a market leader,or a market follower?