[精选]新产品开发整体流程介绍（PPT33）

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1、C-System Introduction will cover Role&Responsibility(R&R)Process Cx Stage:C0:Proposal phase 構想階段 C1:Planning phase 規劃階段 C2:R&D Design phase 設計階段 C3:Lab Pilot Run phase 樣品試作階段 C4:Eng Pilot Run phase 工程試作階段 C5:PD Pilot Run phase 試產階段 C6:Mass Production phase 量產階段Role&ResponsibilityFunctionResponsibili

2、tyPM產品經理-Product Manager(或計畫專案經理-Project Manager)為所負責計畫或產品線成敗之總負責人,將依產品線之性質指定專人負責某類產品,必須對所負責產品線專業領域之發展及行銷雙方面皆有相當程度的了解.並依照產品之條件及市場狀況,做適當的運用,訂定技術或產品市場競爭策略,並在適當的時機推出適當之技術或產品.TMTMisresponsibletocoordinatetechnicalissuesconflictamongHW,SW,IDandMEanddecision-making.TMhastohandleallprojecttechnicalissues.P

3、CC為規劃推廣、連絡及控制專案進行的負責人,掌握專案進行之情況以協助處理異常狀況,使新產品能順暢切入工廠且如期推出,以提高產品競爭力.協助 R&D RELEASE 開發階段 BOM CHANGE NOTICE.R&DR&D 包括電子部門及工業設計部門,若只寫 HW(Hardware Design)則指電子部門,若只寫 ID(INDUSTRIAL DESIGN)則指工業設計部門;包括ME,Thermal,Packing design.若只寫 SW(Software design)則指軟體設計部門有負責 BIOS,Driver 及 Pre-load 不同工作性質之軟體開發功能.R&D 人員負責產品

4、之開發、設計、測試規劃，包括 H/W、S/W及ID的開發、設計、提出新發明及著作權揭露書.-Wistron CaseRole&ResponsibilityFunctionResponsibilityHW(Hardware Design)*HardwareisresponsibleforElectronicEngineeringDesign*Co-workswithS/WandQTtomakesurethattheeveryfunctionworkswellaccordingtospec.*H/WshouldconducttechnicaltransfertoPE.*H/Wshouldinput

5、,update,andmaintainthebugs/issuesinformationinthebugtrackingsystem.SW(Software Design)*SoftwareisresponsibleforthedesignofBIOS,Driver,Utilities,andS/WPreload.*S/Wco-workswithH/WandQTtomakesurethateveryfunctionworkswellaccordingtothespecification.*S/WhastoreleasetheSCDandtheCert.TeamDocument.*S/Wshou

6、ldconducttechnicaltransfertoTE.*S/Whastoinput/update/maintainthebugs/issuesinformationinthebugtrackingsystem.ID/ME(Industrial Design/Mechanical Engineering)*ID/MEisresponsibleforMechanicalEngineering,ThermalandPackingdesigns.*ID/MEshouldconducttechnicaltransfertoPME.*ID/MEshouldinput,update,andmaint

7、ainthebugs/issuesinformationinthebugtrackingsystemused.-Wistron CaseRole&ResponsibilityFunctionResponsibilityPA(EMI/Safety,QT,CE/Reliability,PCB,OS Certification)為產品保證暨開發支援Function之總稱,主要負責根據 MRS/PES 執行各項產品之測試,諸如 EMC/Safety:REGULATORY TEST,CE:RELIABILITY TEST 及 KEY COMPONENT APPROVAL,PCB:PCB LAYOUT,D

8、C:BOM,OS:OS 認證 etc;EMC/SafetyAll products to meet EMC/Safety requirements and guarantee the legality in the international marketing.申請產品之安規、測試、Debug.QT為R&D轄下所屬之測試單位人員,主要負責各項產品之測試,諸如COMPATIBILITY TEST,SOFTWARE TEST,S/W PRELOAD TEST,DIAGNOSTIC PROGRAM TEST,ETC.,CE/Reliability組件承認測試、不良品故障分析及其他附件等材料品質之管

9、制及保證 產品相關之可靠度與環境實驗，以及可靠度工程之研究與制定.PCBPCB Layout之申請、PCB之設計、Orcad library&Mentor library的建立與管理.信號品質CAE分析,PCB layout外包廠商之管理，PCB製造廠商之管理.OS Certification執行公司各產品之 OS 相容性認證測試及 LOGO 申請.O.S.Beta Site 測試 PDM料號編碼及控管,BOM製作-Wistron CaseRole&ResponsibilityFunctionResponsibilityAM(Account Manager)1.爭取訂單與客戶合約協商.2.協調

10、產品SPEC.工程變更 SAMPLE APPROVAL.3.適時反應市場需求與趨勢.MM(Material Management)1.MMisresponsiblefornewsupplierdevelopment,partspurchasing2.Controllingmechanicaltoolingstatusincludingtheschedule,capacity,partsreadiness,concerns3.Managethedependencies,longlead-timeitems.4.MMalsoco-workswithSQMandCEforcomponentquali

11、tyimprovementandthekeycomponentQVLfinalversionSQM(Supplier Quality Management)*零件品質管理及參與分包商之評鑑/管理(SQRC Plan/Status)*負責異常材料分析、追蹤與改善.*負責進行產品QVLCANDIDATEAPPROVAL作業系統ATmfg.GCSD1.開發及推動全球客戶服務及支援計劃.2.各項售後服務及支援作業.3.參與 Field 品質改善作業(EWG)FI負責評估 Project Cost,決定 Project 是否可行以及 Project 所花費之 Cost.Legal合約及專利審核-Wist

12、ron CaseRole&ResponsibilityFunctionResponsibilityCFECFEactsonbehalfofWistronglobalmanufacturingoperationtodealwiththecustomer,andalsoactsasarepresentativeofthecustomerwhendealingwithinternalWistronteams.BasedontheC4/C5checklist,relatedreportsandprojectstatus,CFEisresponsibletoconcludetheexitjudgment

13、(ReadyorNotready)duringC4/C5ExitmeetingstodeterminewhetheraproductcanmoveontoPDpilotrun/MPornotNPI1.負責規劃、協調、整合與提供各Site製造所需相關資訊與技術資料2.協調安排新產品轉移至海外生產工廠 3.協調處理海外生產工廠發生之生產相關問題 PE/PME1.產品設計審查,產品問題之發覺及產品移交.2.協助生產良率提昇,克服生產瓶頸,提高生產力.3.協助訂定製造規格及引進新的製作技術,進行改善以確保產品品質.IE1.設計及管理一個高效率的整合製造系統.2.消除浪費、杜絕不合理，提高生產力3.生產

14、流程規劃、製程改善、標準工時製定 QA1.執行製程及產品之檢驗並反應品質報告請相關單位改善品質 2.收集及處理市場及客戶品質回饋資料反應相關單位改善品質 3.協助工程單位必要之驗證測試.4.建立PCBA,Final Assembly之檢驗標準QE1.執行 DQA.FDI,MTBF,ORT Test2.執行產品開發過程之可靠度及環境測試(C4)3.協助工程測試驗證 4.品質工程問題分析與解決 -Wistron CaseRole&ResponsibilityFunctionResponsibilityPD(Production)PDhastoworkwithPE,PMEandIErespectiv

15、elytogettestingequipment&tools,assemblytools,andSOPreadybeforeC5Exit.PDisresponsibletoproducetheproduct.PDisnotjustforefficiencyonlybutalsoquality.PSE(Process Engineer)PSEisresponsibleforSMTprocessandforreleasingtheSMTpilotrunreport.PSEisalsoresponsiblefortheprocesscontinuousimprovement(CIP).FAE(Fai

16、lure Analysis Engineer)or REFAEisresponsibleforissuingthefailureanalysisreportandforwardingthistorelateddepartmentsforproductqualityimprovement.FAEisalsoresponsibleforpreparingrepairSOPifapplicable.TETEisresponsibleforprovidingandmaintainingTestPlanandTestProgram.TEalsoimplementallthepreloadtoproduc

17、tionlineandreporttheproblemsrelatedtopreloadtopreloadteam.PMC/GPMC(Plan Material Control/Global Plan Material Control)GPMC/PMCisresponsibleforproductfulfillment,finalshippingmodel,supplysiteandcapacityplan,andrampupplanforallsites.-Wistron CaseWistron C-System Quality ControlProposalPhasePlanningPha

18、seR&DDesignPhaseLabPilot-runPhaseEngineeringPilot-runPhaseProductionPilot-runPhaseMassProductionPhaseC0C1C2C3C4C5CheckPointWistron C-PhaseNPIFDI/MTBFDQA/PQC/FQC Compatibility/Diagnostic-Simulation Test-Layout&drawing-Signal Integrity-DFX Check-AVL-C-Test Plans Reliability/Stress EMI/Safety OS&Pre-Lo

19、adWIH/WPH/WZS/WKS-MRS Check-Service Cost Estimate-Simulation-Design Peer Review-Lessons LearnedAvailabilityDevelop PlanLaunch FAI&SPCMTBFDemoCIP/CLCAPareto AnalysisEWG ReadyAFRTest ReportsPre-QVL ReadyDiagnostics ProgramBug List&ActionDCN/ECN/ECR FAI report PFMEASQRCTrainingMTBF ReviewQMP/QPA/QSAFPY

20、RPPAPServiceability DesignTest PlansIntegrate Design Review Signal QualityDFX IndexInitial Supplier AuditMemorandumDFMEASimulationMTBF EstimateMVPConcept/ProposalMRSDefinitionScopeSCEInvestigation&ProposalDesign&SourcingIntegrationValidationReleaseProduct Life CycleC6OOB/OBAORT/StressEWG/FQHAFR/DOAN

21、ew C System ArchitectureProgressC0 ExitC0 ActivityC0 EntryC1 ExitC1 ActivityC1 EntryC2 ExitC2 ActivityC2 EntryC3 ExitC3 ActivityC3 EntryC4 ExitC4 ActivityC4 EntryC5 ExitC5 ActivityC5 EntryC6 ExitC6 ActivityC6 EntryTimeDetail ActivitiesSubjectScopeDefinitionProcedure.Activities DefinitionRecord&Repor

22、tFormat DefinitionEscalation RuleMeasurementStandardProject Management&System MaintenanceNew C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng.Pilot Run PhaseProduction Pilot run PhaseMass production phaseC2 meetingC3 meetingC4 meetingC5 meeting C3checkli

23、st HWDVtestreport SWFVtestreport MEtestreport Reliabilitytestreport(prel.)ME/Artwork/packingdrawing PAL/ROMdatalisting C3manufacturabilityreviewreport Sampleapprovestatus&buglistreview C4checklist BOM QVL Timestandard SystemBIOS/KBCFWrelease S/WDriver/AP/Utility/DiagnosticRelease EEEng.P/Rreport SMT

24、WSP/Rreport PCBAWSP/Rreport MEEng.P/Rreport Eng.P/RQAreviewreport Schematics&jumpersetting Testprogram/Procedure SOPforPCBA/FA UsermanualR/N Packingstandard Compatibilitytestreport ReliabilityandC4Reliabilitytestreport KeyComponentverification Sparepartslist C5checklist ServiceGuide EMCSafetyreport

25、PDP/Ryieldrateanalysisrpt PCBAinspectioninstruction Productinspectioninstruction MTBFDEMOtestreportPMPMC0 meetingC1 meetingPM C1checklist Inventiondisclosure Timeschedule Projectteam Modelnumberdefine Greendesignguideandreviewchecklist NonQVL/Sampleapprovalrequestform C2checklist PES EMC/SafetyReque

26、stForm BOM/QVL(Prel.)PCBLayout(prel.)OutsourcingmodulespecificationPMNPIC0C1C2C3C4C5C6C6 meetingGCSD C6checklist ProductphaseoutnoticeC0 ChecklistMRSC0/PM C0 Meeting階段 C0構想階段(Proposal Phase)負責單位 計畫經理(Project Manager)或產品經理(Product Manager)目的*確訂提案構想或市場需求規格書(MRS)*可行性分析 工作重點 *相關提案之市場資料搜集*相關提案之關鍵技術資料搜集*R

27、&D 提出技術可行性分析*PM 執行可行性及效益評估審核會議 C0目的 評估是否成立專案計畫，進行研發 檢核項目 計畫提案書或市場需求規格書(MRS)C0-C0-工作重點及檢核項目工作重點及檢核項目New C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng.Pilot Run PhaseProduction Pilot run PhaseMass production phaseC2 meetingC3 meetingC4 meetingC5 meeting

28、 C3checklist HWDVtestreport SWFVtestreport MEtestreport Reliabilitytestreport(prel.)ME/Artwork/packingdrawing PAL/ROMdatalisting C3manufacturabilityreviewreport Sampleapprovestatus&buglistreview C4checklist BOM QVL Timestandard SystemBIOS/KBCFWrelease S/WDriver/AP/Utility/DiagnosticRelease EEEng.P/R

29、report SMTWSP/Rreport PCBAWSP/Rreport MEEng.P/Rreport Eng.P/RQAreviewreport Schematics&jumpersetting Testprogram/Procedure SOPforPCBA/FA UsermanualR/N Packingstandard Compatibilitytestreport ReliabilityandC4Reliabilitytestreport KeyComponentverification Sparepartslist C5checklist ServiceGuide EMCSaf

30、etyreport PDP/Ryieldrateanalysisrpt PCBAinspectioninstruction Productinspectioninstruction MTBFDEMOtestreportPMPMC0 meetingC1 meetingPM C0Checklist MRS C2checklist PES EMC/SafetyRequestForm BOM/QVL(Prel.)PCBLayout(prel.)OutsourcingmodulespecificationPMNPIC0C1C2C3C4C5C6C6 meetingGCSD C6checklist Prod

31、uctphaseoutnoticeC1 checklistInventiondisclosureTime scheduleProject teamModel number defineGreen design guide and reviewcheck listNon QVL/Sampleapproval request formC1/PMC1 MeetingC1-C1-工作重點及檢核項目工作重點及檢核項目階段 C1規劃階段(Planning Phase)負責單位 計畫經理(Project Manager)或產品經理(Product Manager)目的*規格的擬訂*專案組織的成立*專案時程的

32、規劃 工作重點 *選任技術經理(Technical Manager,簡稱TM)並成立專案組織*計畫專案經理(Project Manager)或產品經理，規劃專案時程*召開C1審核會議*法務確認Legal Concern、如Potential Patent List,Invention Disclosure*成立專案團隊 審核會議 C1目的 成立專案團隊、確定開發時程 檢核項目 TimeScheduleProjectTeamInventionDisclosureGreenDesignCheckListSampleRequestFormCase-bottle Coca in England開採鋁礦

33、開採鋁礦一噸鋁土提鍊半噸氧化鋁一噸鋁土提鍊半噸氧化鋁半小時加工半小時加工半噸氧化鋁熔煉成半噸氧化鋁熔煉成1/4噸金屬鋁噸金屬鋁再加工二週成鋁錠再加工二週成鋁錠瑞典或梛威瑞典或梛威熔爐工廠熔爐工廠澳大利亞澳大利亞澳大利亞澳大利亞化學還原工廠化學還原工廠加熱至華氏加熱至華氏900度度壓延成壓延成1/8 inch薄片薄片瑞典和德國瑞典和德國壓延廠壓延廠船運一個月船運一個月冷軋成冷軋成1/80 inch薄片薄片冷軋廠冷軋廠英國易開罐廠英國易開罐廠成型，清洗，烘乾，防鏽成型，清洗，烘乾，防鏽裝填，印刷裝填，印刷英國可樂廠英國可樂廠消費消費鋁罐回收儘鋁罐回收儘16%Ecological Rucksack(

34、生態包袱生態包袱)生產一片半導體晶片所產生之廢料為產生產一片半導體晶片所產生之廢料為產品重量之品重量之十萬倍十萬倍生產一台筆記型電腦所產生之廢料為產生產一台筆記型電腦所產生之廢料為產品重量之品重量之四千倍四千倍生產一公升佛羅里達橘子汁需要生產一公升佛羅里達橘子汁需要兩公升兩公升汽油及一千公升之水汽油及一千公升之水生產一噸紙需用掉生產一噸紙需用掉九十八噸九十八噸之其他資源之其他資源 資料來源資料來源:綠色資本主義綠色資本主義 天下出版社天下出版社EU RoHS Directive 指令期程指令期程 2003.01.27 指令發布指令發布 2003.02.13 歐盟公報發行歐盟公報發行,指令生效指

35、令生效 2004.08.13 轉為會員國當地法律轉為會員國當地法律,法規或行政指令法規或行政指令 2006.07.01 新投入之產品不得含有禁用物質新投入之產品不得含有禁用物質 指令要求指令要求/禁用項目禁用項目 鉛鉛(Pb)鎘鎘 (Cd)汞汞(Hg)六價鉻六價鉻(Cr6+)多溴聯苯多溴聯苯(PBB)多溴化二苯乙醚多溴化二苯乙醚(PBDE)(Therestrictionoftheuseofcertainhazardoussubstancesinelectricalandelectronicequipment)EU RoHS 管制規格管制規格SubstancesE.U.建議值Lead(Pb)鉛;

36、銲錫1000 PPMLead(Pb)鉛;塑膠,線材,塗料1000 PPMCadmium(Cd)鎘100 PPMMercury(Hg)汞1000 PPMHex.Chromium(Cr6+)六價鉻1000 PPMPBB(聚溴聯苯)1000 PPMPBDE(聚溴二苯醚)1000 PPM重金屬：重金屬：汞、鉛、鎘、六價鉻汞、鉛、鎘、六價鉻溴性耐燃劑：聚溴聯苯溴性耐燃劑：聚溴聯苯(PBBPBBs)s)、溴聯苯醚溴聯苯醚(PBDEPBDEs)s)註：另有註：另有管制規範外管制規範外的項目的項目EU WEEE Directive Directive 2002/96/ECDirective 2002/96/E

37、C期程期程 2003.01.27 2003.01.27 指令發布指令發布 2003.02.13 2003.02.13 歐盟公報發行，指令生效歐盟公報發行，指令生效 2004.08.13 2004.08.13 轉為會員國當地法律轉為會員國當地法律,法規或行政指令法規或行政指令 2005.08.13 2005.08.13 完成回收系統建構完成回收系統建構,製造商因應回收之製造商因應回收之 財務規劃就緒財務規劃就緒 2006.12.31 2006.12.31 回收再利用率達每人每年回收再利用率達每人每年4 4kgkg 2008.12.31 2008.12.31 訂定下階段目標訂定下階段目標 回收回收

38、Target of Recovery and RecyclingTarget of Recovery and Recycling(Waste Electrical and Electronic Equipment)WEEE Category Large household appliances Small household appliances IT&telecommunications appliances Consumer equipment Lighting equipment Electrical and electronic tools Toys,leisure&sports eq

39、uipment Medical devices Monitoring and control instruments Automatic dispensers Rate of Recovery Rate of Recycling 80%75%70%50%75%65%75%65%70%50%70%50%70%50%*70%50%80%75%*To be determined by 31 December 2006 New C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run Ph

40、aseEng.Pilot Run PhaseProduction Pilot run PhaseMass production phaseC2 meetingC3 meetingC4 meetingC5 meeting C3checklist HWDVtestreport SWFVtestreport MEtestreport Reliabilitytestreport(prel.)ME/Artwork/packingdrawing PAL/ROMdatalisting C3manufacturabilityreviewreport Sampleapprovestatus&buglistrev

41、iew C4checklist BOM QVL Timestandard SystemBIOS/KBCFWrelease S/WDriver/AP/Utility/DiagnosticRelease EEEng.P/Rreport SMTWSP/Rreport PCBAWSP/Rreport MEEng.P/Rreport Eng.P/RQAreviewreport Schematics&jumpersetting Testprogram/Procedure SOPforPCBA/FA UsermanualR/N Packingstandard Compatibilitytestreport

42、ReliabilityandC4Reliabilitytestreport KeyComponentverification Sparepartslist C5checklist ServiceGuide EMCSafetyreport PDP/Ryieldrateanalysisrpt PCBAinspectioninstruction Productinspectioninstruction MTBFDEMOtestreportPMPMC0 meetingC1 meetingPM C0Checklist MRSPM C1checklist Inventiondisclosure Times

43、chedule Projectteam Modelnumberdefine Greendesignguideandreviewchecklist NonQVL/SampleapprovalrequestformNPIC0C1C2C3C4C5C6C6 meetingGCSD C6checklist ProductphaseoutnoticeC2 checklistPESEMC/Safety Request FormBOM/QVL(Prel.)PCB Layout(prel.)Outsourcing modulespecificationC2/PMC2 MeetingC2-C2-工作重點及檢核項目

44、工作重點及檢核項目階段 C2設計階段(R&DDesignPhase)負責單位 技術經理(TechnicalManager)研發部門 目的*軟、硬體、機構設計*証實設計可行性*修正軟、硬體、機構規格 工作重點 *電路設計並完成電路圖*機構設計並完成機構設計圖*機電整合設計並完成機電介面設計*軟體設計並完成初步版本*電路設計Review*機構設計Review*機電整合設計Review*建立初步之測試計畫(硬體、軟體、機構)審核會議 C2目的*確定計畫規格*檢討設計階段之工作成效*決定是否進入樣品試作*查核是否發出專利之申請 檢核項目 Schematics(Preliminary)S/W Speci

45、ficationMechanical&ThermalTest PlanInventionDisclosureInventionDisclosureNew C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng.Pilot Run PhaseProduction Pilot run PhaseMass production phaseC2 meetingC3 meetingC4 meetingC5 meeting C4checklist BOM QVL Times

46、tandard SystemBIOS/KBCFWrelease S/WDriver/AP/Utility/DiagnosticRelease EEEng.P/Rreport SMTWSP/Rreport PCBAWSP/Rreport MEEng.P/Rreport Eng.P/RQAreviewreport Schematics&jumpersetting Testprogram/Procedure SOPforPCBA/FA UsermanualR/N Packingstandard Compatibilitytestreport ReliabilityandC4Reliabilityte

47、streport KeyComponentverification Sparepartslist C5checklist ServiceGuide EMCSafetyreport PDP/Ryieldrateanalysisrpt PCBAinspectioninstruction Productinspectioninstruction MTBFDEMOtestreportPMC0 meetingC1 meetingPM C0Checklist MRSPM C1checklist Inventiondisclosure Timeschedule Projectteam Modelnumber

48、define Greendesignguideandreviewchecklist NonQVL/Sampleapprovalrequestform C2checklist PES EMC/SafetyRequestForm BOM/QVL(Prel.)PCBLayout(prel.)OutsourcingmodulespecificationPMNPIC0C1C2C3C4C5C6C6 meetingGCSD C6checklist ProductphaseoutnoticeC3 checklistHW DV test reportSW FV test reportME test report

49、Reliability test report(prel.)ME/Artwork packing drawingPAL/ROM data listingC3 manufacturability review reportSample approve status&bug list reviewC3/PMC3 MeetingC3-C3-工作重點及檢核項目工作重點及檢核項目階段 C3樣品試作階段(LabPilotRunPhase)負責單位 技術經理(TechnicalManager)研發部門 目的*設計驗證*依測試結果修改、變更設計 工作重點 *樣品試作材料準備*樣品試作*針對樣品進行測試及驗證*

50、搜集Project成本資料*擬定C3品質量化目標*機構設計問題檢討及除錯(Debug)，測試報告檢討*電路設計問題檢討及除錯(Debug)，測試報告檢討*軟體設計問題檢討除錯(Debug)，測試報告檢討*法務-稽核文件之形成要件是否符合法定要件或工程規範 -專利著作權、商標等智慧財產權之申請準備 審核會議 C3目的 檢討樣品測試驗證之結果、並決定是否進入工程試作階段 檢核項目*HW design verification report*Micro processor/EEPROM data listing*Mechanical test report*SW function verificat

51、ion test report*Mechanical Drawing(Preliminary)*C3 Test Report*C4 Test Plan New C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng.Pilot Run PhaseProduction Pilot run PhaseMass production phaseC2 meetingC3 meetingC4 meetingC5 meeting C3checklist HWDVtestre

52、port SWFVtestreport MEtestreport Reliabilitytestreport(prel.)ME/Artwork/packingdrawing PAL/ROMdatalisting C3manufacturabilityreviewreport Sampleapprovestatus&buglistreview C5checklist ServiceGuide EMCSafetyreport PDP/Ryieldrateanalysisrpt PCBAinspectioninstruction Productinspectioninstruction MTBFDE

53、MOtestreportPMC0 meetingC1 meetingPM C0Checklist MRSPM C1checklist Inventiondisclosure Timeschedule Projectteam Modelnumberdefine Greendesignguideandreviewchecklist NonQVL/Sampleapprovalrequestform C2checklist PES EMC/SafetyRequestForm BOM/QVL(Prel.)PCBLayout(prel.)OutsourcingmodulespecificationPMNP

54、IC0C1C2C3C4C5C6C6 meetingGCSD C6checklist Productphaseoutnotice C4 checklist BOM QVL Time standard System BIOS/KBC FW release S/W Driver/AP/Utility/Diagnostic release EE Eng.P/R report SMT WS P/R report PCBA WS P/R report ME Eng.P/R report Eng.P/R QA review report Schematics&jumper setting Test prog

55、ram/Procedure SOP for PCBA/FA User manual R/N Packing standard Compatibility test report Reliability and C4 Reliability test report Key Component verification Spare parts listC4/PMC4 MeetingWistron Mobile Reliability Test PlanEnvironmentThermalProfileTestTemperatureandHumidityTestVibration,Shock,Dro

56、pTestsAltitudeTest,AcousticsTestsMTBFPrediction EMCLightning/SurgeTestVoltageDipTestEFT,ESDTestHarmonicTestIEC1000-4-XXEMI/EMSPower Line InterferenceLineVoltage/FrequencyTestPowerSurgeTestVoltageDipandInterruptionPowerOn/OffTestEFT/BImmunityTestComplexMarginTestTransportationVibrationTestAltitudeTes

57、tShockTestDropTestUser InclineOperationTestBenchHandlingTestPowerSavingTestPressureTestAudioQualityTortureTestReliability Test LCD ModuleWistron Mobile Reliability Test PlanItemTestConditionSampleSizeTimeResultHigh Temp/High Humid Op50 80%RH Dynamin20500 HoursPassLow Temp Op0,Dynamic5500 HoursPassHi

58、gh Temp Op60,Dynamic10500 HoursPassHigh Temp/High Humid storage60,90%RH,Storage2240 HoursPassLow Temp storage-20,Storage2240 HoursPassT/C(Non-Op)-20(30Min)60(30Min),Storage3100cyclePassAltitude testOperating&Storage272 HoursPassELP-20,Dynamic5072 HoursPassVibration(Non-Op)5500Hz,0.37Oct/min,1.5G,X/Y

59、/Z3-PassShock(Non-Op)180G,2msec,Half Sine,X,Y,Z3-PassBox Vibration5500Hz,1.0G,0.5Oct/min15-PassBox Drop76 drop15-PassESDOperatingTop_Case:12kVPanel :15kVPanel :15kV5-PassNon-OperatingUser connector:2kVBottom cover :12kV5-PassPanel(ref)3kV5-PassPush5kgf(result After 24Hours)2-PassImage StickingMosaic

60、 Pattern(8 X 6)104 HoursPassWistron Mobile Reliability Test-LCDC4-C4-工作重點及檢核項目工作重點及檢核項目階段 C4工程試作階段(ENGPilotRunPhase)負責單位 技術經理(TechnicalManager)研發部門工程部門 目的*工程試作與驗證*依驗證結果改善設計*準備技術資料以便技術移轉、授權或移轉技術至相關生產單位 工作重點 完成系統軟體或應用軟體之設計、測試及除錯提出軟體之程式碼(Source Code)正式發出電路圖(Schematics)、料表清單(BOM)及已驗證料表供應商清單(QVL)進行工程試作階段

61、之測試、驗證及除錯並提出測試驗證報告提出工程試作階段之試作報告及改善建議完成生產或技術移轉所需之相關測試程式及程序法務完成專利、著作權、商標申請 審核會議 C4目的 檢討工程試作結果，並決定是否進入試產階段完成各項技術移轉或生產所需之文件，並進行系統殘留問題之檢討與對策驗證 檢核項目*S/W Firmware release*BOM*ME ENG P/R report*EE ENG P/R report*Test Program*PCB artwork*C4 Test report*Schematics*SW source code*Transfer plan New C System Pro

62、duct DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng.Pilot Run PhaseProduction Pilot run PhaseMass production phaseC2 meetingC3 meetingC4 meetingC5 meeting C3checklist HWDVtestreport SWFVtestreport MEtestreport Reliabilitytestreport(prel.)ME/Artwork/packingdrawing PAL/R

63、OMdatalisting C3manufacturabilityreviewreport Sampleapprovestatus&buglistreview C4checklist BOM QVL Timestandard SystemBIOS/KBCFWrelease S/WDriver/AP/Utility/DiagnosticRelease EEEng.P/Rreport SMTWSP/Rreport PCBAWSP/Rreport MEEng.P/Rreport Eng.P/RQAreviewreport Schematics&jumpersetting Testprogram/Pr

64、ocedure SOPforPCBA/FA UsermanualR/N Packingstandard Compatibilitytestreport ReliabilityandC4Reliabilitytestreport KeyComponentverification SparepartslistPMPMC0 meetingC1 meetingPM C0Checklist MRSPM C1checklist Inventiondisclosure Timeschedule Projectteam Modelnumberdefine Greendesignguideandreviewch

65、ecklist NonQVL/Sampleapprovalrequestform C2checklist PES EMC/SafetyRequestForm BOM/QVL(Prel.)PCBLayout(prel.)OutsourcingmodulespecificationPMC0C1C2C3C4C5C6C6 meetingGCSD C6checklist ProductphaseoutnoticeC5 checklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instruct

66、ionProduct inspection instructionMTBF DEMO test reportC5/NPIC5 MeetingC5-C5-工作重點及檢核項目工作重點及檢核項目階段 C5試產階段(ProductionPilotRunPhase)負責單位 生產部門(Production)物管部門(Material Management)工程部門(Engineering)技術經理(TechnicalManager)研發部門(R&D)目的 預為建立量產之準備,完成各項生產必備之文件,並進行產品殘留問題之檢討與對策驗證 工作重點 *提出 FDI 及MTBF DEMO TEST REPORT.*提出 ACT(ACCEPT TEST REPORT)*提出 PD PILOT RUN YIELD RATE ANALYSIS REPORT*殘存 ISSUE 之追蹤與結果*REVIEW 量產材料狀況*取得各項安全規格之合格證明*取得 REQUEST OS 認證之合格證明*Service Guide&Spare Parts List 審核會議 C5目的 檢討試產結果及生產作業與流程,並決定是否進